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Current Issue
Volume 4, 2024
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Review of research on arterial vascular calcified plaque grinding
ZHAI Shaobo
,
LIU Yao
,
SHEN Bin
,
LI Jiahao
,
GUO Zhanling
doi:
10.13394/j.cnki.jgszz.2023.0162
224
HTML
124
36
Report on operation of Chinese superhard industry in 2023
SUN Zhaoda
,
ZHANG Beibei
,
LI Lijuan
,
MA Ning
,
LI Zhihong
doi:
10.13394/j.cnki.jgszz.2024.1004
169
HTML
113
47
Pressure-transmitting properties of pyrophyllites from different localities
LIU Li
,
SHAO Fangyuan
,
LUO Yucai
,
WU Qiang
,
YU Jiantao
,
YU Jinping
,
WANG Haikuo
,
HOU Zhiqiang
,
WANG Chao
,
YANG Yikan
doi:
10.13394/j.cnki.jgszz.2023.0152
126
HTML
81
15
Preparation and properties of Mo
2
C-TiN
0.3
composite materials at high temperature and high pressure
ZOU Qin
,
WANG Kuan
,
LI Yanguo
,
DAI Weiji
,
LUO Yongan
doi:
10.13394/j.cnki.jgszz.2023.0157
111
HTML
50
9
Effect of sintering process on properties of CuSnZn alloy powder
CAO Xinmin
,
BAO Li
,
LI Zhen
,
CHENG Chuanwei
,
CHEN Peng
,
PAN Jianjun
,
YU Qi
,
YU Xinquan
doi:
10.13394/j.cnki.jgszz.2023.0173
156
HTML
67
11
Preparation of diamond coated floating core head and its application in copper pipe production
CUI Yuming
,
WANG Yong
,
LI Guohua
,
JIANG Long
,
DONG Wang
doi:
10.13394/j.cnki.jgszz.2023.0138
304
HTML
99
0
Rapid formation of TiC coating on diamond surface through thermal explosion reaction
SHI Dongli
,
MA Yao
,
LI Tao
doi:
10.13394/j.cnki.jgszz.2023.0170
335
HTML
148
3
Influence of diamond layer chamfer parameters on performance of PDC cutters
ZHANG Suhui
,
WANG Chuanliu
,
LI Geng
doi:
10.13394/j.cnki.jgszz.2023.0209
118
HTML
51
14
Numerical simulation of bottomhole flow field of PDC bit in horizontal well
LI Sai
,
WANG Hongbo
,
CHENG Shuting
,
CAI Maosheng
,
ZHANG Chunjiang
doi:
10.13394/j.cnki.jgszz.2023.0129
285
HTML
87
3
Analysis and optimization of traveling wave vibration of large diamond thin-wall drill bits
LIU Xingdong
,
ZHANG Dechen
,
WANG Yubo
,
GAO Xianyi
,
MA Guoqing
doi:
10.13394/j.cnki.jgszz.2023.0137
308
HTML
103
6
Simulation and experimental study on micro-cutting silicon carbide crystal with single grain diamond
YANG Yufei
,
LI Xiang
,
HE Yan
,
LIU Ming
,
XU Zicheng
,
GAO Xingjun
doi:
10.13394/j.cnki.jgszz.2023.0158
539
HTML
185
26
Physical and chemical characterization of the surface and removal process of silicon carbide ceramics by femtosecond laser processing
XU Dongqu
,
WANG Chengyong
,
DU Cezhi
,
DING Feng
,
HU Xiaoyue
doi:
10.13394/j.cnki.jgszz.2023.0088
568
HTML
173
22
Online recognition of contour error of diamond roller
ZHAO Huadong
,
HE Honghui
,
ZHU Zhenwei
,
ZHOU Shuaikang
,
LIU Chang
doi:
10.13394/j.cnki.jgszz.2023.0148
421
HTML
130
9
Effect of lapping pressure on surface quality of polycrystalline diamond
SUN Guodong
,
LI Weicui
,
HU Jinzhao
,
LI Shuqiang
,
HUANG Shutao
doi:
10.13394/j.cnki.jgszz.2023.0036
493
HTML
148
15
CFD simulation and experiments of abrasive water jet polishing for micropores
CUI Zihan
,
HAN Bing
,
WU Pengcheng
,
LI Qing
,
MA Xiaogang
,
DING Yunlong
doi:
10.13394/j.cnki.jgszz.2023.0120
132
HTML
60
7
Experimental study on tangential vibration assisted abrasive flow finishing of circular tubes
WANG Shuo
,
DONG Zhiguo
,
ZHENG Zhixin
,
WEN Yongji
,
CHEN Pan
doi:
10.13394/j.cnki.jgszz.2023.0189
102
HTML
55
3
Latest Accepted Articles
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doi:
10.13394/j.cnki.jgszz.2023.0238
0
Key factors affecting the performance of diamond wire drawing die coatings
doi:
10.13394/j.cnki.jgszz.2024.0104
7
Study on diamond bimetallic coating technology
doi:
10.13394/j.cnki.jgszz.2024.0098
106
Experimental Study on Magnetic Abrasive Finishing of Inner Pipe Surface Based on Optimized Halbach Array
doi:
10.13394/j.cnki.jgszz.2024.0092
60
Surface morphology segmentation and evaluation of diamond lapping pad based on improved Mask R-CNN
doi:
10.13394/j.cnki.jgszz.2024.0080
137
Experimental on the end face grinding stability of thin-walled CFRP circular cell
doi:
10.13394/j.cnki.jgszz.2024.0054
155
Advance on molecular dynamics simulations of precision polishing of SiC
doi:
10.13394/j.cnki.jgszz.2024.0070
219
Effect of heat treated tungsten interlayer on microcrystalline diamond coatings
doi:
10.13394/j.cnki.jgszz.2024.0063
102
Effect of TiH
2
addition on the grinding performance of Cu
3
Sn intermetallic compound diamond wheels
doi:
10.13394/j.cnki.jgszz.2023.0261
157
Tribological Performance of Alternating Multilayer Diamond Films on Si3N4 Ceramic Substrates
doi:
10.13394/j.cnki.jgszz.2023.0269
119
Prediction and Optimization of Robotic Machining Grinding Force based on Neural Network-Genetic Algorithm
doi:
10.13394/j.cnki.jgszz.2024.0045
131
doi:
10.13394/j.cnki.jgszz.2023.0252
174
Characterization of flow field for chemical-mechanical polishing of silicon carbide under ultrasonic action
doi:
10.13394/j.cnki.jgszz.2023.0273
168
Parameter calibration of a discrete element simulation model for dry lightweight heterogeneous media
doi:
10.13394/j.cnki.jgszz.2024.0016
76
Study on the performance of brazed micronized diamond grinding head
doi:
10.13394/j.cnki.jgszz.2024.0025
147
Highly efficient polishing of polycrystalline diamond via atmosphere inductively coupled plasma
doi:
10.13394/j.cnki.jgszz.2023.0281
301
A Study on the Numerical Simulation of Rock Breaking by PDC Wear Teeth Cutting
doi:
10.13394/j.cnki.jgszz.2023.0258
172
doi:
10.13394/j.cnki.jgszz.2024.0019
117
Experimental Study on Grinding Silicon Carbide with Small Diameter Diamond Grinding Wheel
doi:
10.13394/j.cnki.jgszz.2024.0030
166
Study on the influence of orderly arrangement on grinding force in diamond roller dressing process
doi:
10.13394/j.cnki.jgszz.2024.0004
202
doi:
10.13394/j.cnki.jgszz.2024.0013
199
doi:
10.13394/j.cnki.jgszz.2023.0272
215
Preparation and propertiesof intermetallic-bonded diamond grindingwheel for thinning silicon carbide wafers
doi:
10.13394/j.cnki.jgszz.2023.0250
398
Numerical simulation investigations into the effect of machining parameters on the cutting process for ZrO2 ceramics
doi:
10.13394/j.cnki.jgszz.2023.0188
261
Simulation study of cutting fluid flow field in kerf of fine diameter diamond wire saw
doi:
10.13394/j.cnki.jgszz.2023.0235
506
doi:
10.13394/j.cnki.jgszz.2023.0267
247
doi:
10.13394/j.cnki.jgszz.2023.0164
727
Research Status of Thermal Damage Inhibition Technology for Diamond
doi:
10.13394/j.cnki.jgszz.2023.0166
479
Simulation and experimentalanalysis of composite chamfering of superhard cutting toolsbased on edge grinding technology
doi:
10.13394/j.cnki.jgszz.2023.0223
269
doi:
10.13394/j.cnki.jgszz.2023.0046
303
Prediction of grinding surface roughness of Al2O3-based insulating coating on bearing surface considering the change of grinding wheel surface morphology
doi:
10.13394/j.cnki.jgszz.2023.0118
282
Study on Mechanical Properties and Rock Breaking Effect of Ridge-Shaped Cutters
doi:
10.13394/j.cnki.jgszz.2023.0172
301
Effect of pad and slurry on fixed abrasive polishing of gallium oxide crystal
doi:
10.13394/j.cnki.jgszz.2022-0043
809
Development of CAM system for automatic compound dressing of superabrasive grinding wheels
doi:
10.13394/j.cnki.jgszz.2022-0061
503
Study on the Mechanism and Process Magnetorheological Variable Gap Dynamic Pressure Planarization Finishing
doi:
10.13394/j.cnki.jgszz.2022-0004
596
Effect of Fe
3
O
4
Characteristics on Properties of Solid-phase Fenton Reaction Lapping Pellets for Single-Crystal SiC
doi:
10.13394/j.cnki.jgszz.2022-0008
570
Archive
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The selection of The Most Influential Paper of 2021 has began!
The Diamond & Abrasive Engineering has been indexed by DOAJ
The academic influence of Diamond & Abrasives Engineering just reached a historical record
International Diamond Conference would be held on Nov. 9, 2022 in Zhengzhou, China
Call for applicants to the Young Scientist Awards (2022)
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Simulation method of grinding wheel topography
CAO Youwei
,
QIAO Guochao
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162
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02
Nanoscale removal mechanisms in abrasive machining of brittle solids
HUANG Shuiquan
,
GAO Shang
,
HUANG Chuanzhen
,
HUANG Han
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2079
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342
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03
Research progress and prospect of high entropy oxide
ZHANG Yang
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ZOU Qin
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Research status and prospect of additive manufacturing diamond tools
TAO Yakun
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ZHOU Yan
,
DUAN Longchen
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481
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05
Study on optimal method of induction brazing temperature for single-layer CBN grinding wheel
LI Qilin
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DING Kai
,
LEI Weining
,
SHAN Daping
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1502
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130
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06
Research on grinding of biological tissue
WU Maozhong
,
WANG Chengyong
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ZHENG Lijuan
,
CHEN Zhihua
,
LIU Zhihua
Page View:
1338
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398
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07
Challenges of future high-precision polishing methods for hard-to-process materials by the fusion of environmental control and plasma technology
DOI K. Toshiro
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AIDA Hideo
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OHNISHI Osamu
,
YIN Shaohui
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REN Yinghui
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08
Progress of ultrasonic vibration-assisted machining surface micro-texture and serviceability
BIE Wenbo
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ZHAO Bo
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CHEN Fan
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WANG Xiaobo
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ZHAO Chongyang
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NIU Ying
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Research progress and prospect of high entropy oxide
ZHANG Yang
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ZOU Qin
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LI Yanguo
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LI Yuanyuan
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XU Jiangbo
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WANG Mingzhi
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3983
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02
Nanoscale removal mechanisms in abrasive machining of brittle solids
HUANG Shuiquan
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GAO Shang
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HUANG Chuanzhen
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HUANG Han
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342
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03
Progress of ultrasonic vibration-assisted machining surface micro-texture and serviceability
BIE Wenbo
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ZHAO Bo
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CHEN Fan
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WANG Xiaobo
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ZHAO Chongyang
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NIU Ying
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Research status and prospect of additive manufacturing diamond tools
TAO Yakun
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GAN Jie
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ZHOU Yan
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DUAN Longchen
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481
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05
Preparation methods of boron-doped diamond electrode and its research progresses
LI Lianlian
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CHEN Guanqin
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210
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06
Report on operation of Chinese superhard industry in 2022
LI Lijuan
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07
Challenges of future high-precision polishing methods for hard-to-process materials by the fusion of environmental control and plasma technology
DOI K. Toshiro
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AIDA Hideo
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OHNISHI Osamu
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YIN Shaohui
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352
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08
Study on electrochemical mechanical polishing process of silicon carbide crystal
WANG Lei
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NIU Lin
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AN Zhibo
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JIN Zhuji
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Research progress of metal bond diamond tools
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YAN Qingzhi
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Particle size distribution characteristics of electrostatic minimum quantity lubrication and grinding surface quality evaluation
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ZHANG Naiqing
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LIU Bo
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ZHOU Zongming
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WANG Xuping
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ZHANG Yanbin
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MAO Cong
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LI Changhe
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04
Review on chemical mechanical polishing of silicon wafers
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05
Ultrasonic assisted grinding of SiC
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Research progress in chemical mechanical polishing of single crystal SiC substrates
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