金刚石与磨料磨具工程

1

Research progress of metal bond diamond tools

WU Yanping, YAN Qingzhi

2019, 39(2): 37-45. doi: 10.13394/j.cnki.jgszz.2019.2.0008

Abstract(209)

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2

砂带磨削技术的研究现状和发展方向简介

2020, 40(3): 1-4.

Abstract(138)

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3

Review on chemical mechanical polishing of silicon wafers

XU Jiahui, KANG Renke, DONG Zhigang, WANG Ziguang

2020, 40(4): 24-33. doi: 10.13394/j.cnki.jgszz.2020.4.0004

Abstract(229)

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4

Ultrasonic assisted grinding of SiC_f/SiC composites

KANG Renke, ZHAO Fan, BAO Yan, ZHU Xianglong, DONG Zhigang

2019, 39(4): 85-91. doi: 10.13394/j.cnki.jgszz.2019.4.0015

Abstract(266)

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5

超声加工技术的研究现状和发展方向简介

2020, 40(1): 1-4.

Abstract(85)

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6

Research progress in chemical mechanical polishing of single crystal SiC substrates

DENG Jiayun, PAN Jisheng, ZHANG Qixiang, GUO Xiaohui, YAN Qiusheng

2020, 40(1): 79-91. doi: 10.13394/j.cnki.jgszz.2020.1.0013

Abstract(271)

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7

钛合金切削磨削加工技术研究进展

2020, 40(5): 1-4.

Abstract(92)

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8

Principle and application of orderly arranging grain technology of superabrasives

FENG Chuangju, CUI Zhongming, HE Qingshan, WANG Xing, YANG Moxi

2018, 38(1): 65-72,77. doi: 10.13394/j.cnkij.gszz.2018.1.0012

Abstract(156)

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9

Development of ultrasonic vibration polishing method on workpiece surface

WAN Hongqiang, HAN Peiying, GE Shuai, LI Fancong, LIU Zhihao

2018, 38(2): 94-100. doi: 10.13394/j.cnkij.gszz.2018.2.0019

Abstract(210)

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10

Research progress of PCBN superhard cutting tools

LI Yanguo, CHENG Zhaonan, ZOU Qin, WANG Mingzhi, YIN Yuhang

2019, 39(3): 58-68. doi: 10.13394/j.cnki.jgszz.2019.3.0010

Abstract(231)

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11

大尺寸单晶硅片加工技术简介

2020, 40(4): 1-4.

Abstract(108)

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12

Manufacturing technique and industry status of semiconductor silicon wafers

YAN Zhirui, KU Liming, BAI Dujuan, CHEN Haibin, WANG Yongtao

2020, 40(4): 5-11. doi: 10.13394/j.cnki.jgszz.2020.4.0001

Abstract(129)

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13

Study status and future prospects on ultrasonic assisted grinding of hard and brittle materials

DING Kai, LI Qilin, SU Honghua, CHEN Yurong

2020, 40(1): 5-14. doi: 10.13394/j.cnki.jgszz.2020.1.0001

Abstract(281)

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14

Effects of lights modes and abrasives on UV-photocatalysis assisted polishing of 6H-SiC single crystal

LU Jiabin, XIONG Qiang, YAN Qiusheng, WANG Xin, BIN Shuiming

2019, 39(3): 29-37. doi: 10.13394/j.cnki.jgszz.2019.3.0006

Abstract(82)

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15

Particle size distribution characteristics of electrostatic minimum quantity lubrication and grinding surface quality evaluation

JIA Dongzhou, ZHANG Naiqing, LIU Bo, ZHOU Zongming, WANG Xuping, ZHANG Yanbin, MAO Cong, LI Changhe

2021, 41(3): 89-95. doi: 10.13394/j.cnki.jgszz.2021.3.0013

Abstract(161)

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16

Investigation of grain wear in diamond abrasive belt grinding titanium alloy blade for aeroengine

LIANG Qiaoyun, SHAN Kun, LI Zhaorui, ZOU Lai, HUANG Yun

2020, 40(4): 59-64. doi: 10.13394/j.cnki.jgszz.2020.4.0009

Abstract(137)

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17

Research progress of WC-based cemented carbide tool materials

XIONG Jianchao, ZOU Qin, LI Yanguo, WANG Mingzhi, HE Wenquan

2019, 39(2): 95-102. doi: 10.13394/j.cnki.jgszz.2019.2.0018

Abstract(70)

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18

Comparative study on machining of CFRP by end mill and abrasive router

ZHOU Jingwen, QIN Wenjin, MU Yingjuan, REN Peiqiang, LIU Xing, CHEN Yan

2020, 40(4): 76-80. doi: 10.13394/j.cnki.jgszz.2020.4.0012

Abstract(77)

PDF 2854KB(13)

19

Finite element simulation of and experimental study on three-dimensional drilling of large diameter carbon fiber composites

ZHANG Xun, CHEN Yan, XU Jiuhua, YANG Haojun, CHEN Yijia

2020, 40(2): 53-60. doi: 10.13394/j.cnki.jgszz.2020.2.0010

Abstract(151)

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20

Three-dimensional printing in the application of diamond tools manufacturing

ZHANG Shaohe, TANG Jian, ZHOU Hou, WANG Jialiang

2018, 38(2): 51-56. doi: 10.13394/j.cnkij.gszz.2018.2.0011

Abstract(97)

PDF 1173KB(11)

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