[1] | SHI Shuhao, YANG Li, GUO Shenghui, GAO Jiyun, HOU Ming, LU Yuanjia. Preparation of Ti3SiC2/diamond composites by Ni-Al assisted microwave self-propagating sintering[J]. Diamond & Abrasives Engineering, 2024, 44(1): 22-30. doi: 10.13394/j.cnki.jgszz.2023.0021 |
[2] | WEN Jiazhou, WANG Qingxia, YU Aiwu, WU Chongjun. Removal mechanism of unidirectional Cf/SiC composites based on single diamond grit scratching[J]. Diamond & Abrasives Engineering, 2024, 44(3): 327-334. doi: 10.13394/j.cnki.jgszz.2023.0104 |
[3] | WANG Youzhe, LIU Yao, ZHOU Yang, LI Jiahao, LI Hansen. Experiment on single diamond abrasive scratching 2D SiCf/SiC composite materials[J]. Diamond & Abrasives Engineering, 2024, 44(3): 335-345. doi: 10.13394/j.cnki.jgszz.2023.0275 |
[4] | PANG Jiwei, LI Sheng, GUO Mingbo, WANG Zhaohui, XI Jianren, YANG Xiaotao. Drilling of C/SiC composite micro holes with electroplated diamond bits[J]. Diamond & Abrasives Engineering, 2023, 43(1): 90-95. doi: 10.13394/j.cnki.jgszz.2022.0026 |
[5] | CAI Jianing, FAN Zimin, LE Chen, LI Xin, TANG Mingqiang, ZHAO Fang. Effect of SiC content on properties of copper matrix composites[J]. Diamond & Abrasives Engineering, 2023, 43(6): 743-749. doi: 10.13394/j.cnki.jgszz.2022.0183 |
[6] | CAI Jianing, LE Chen, FAN Zimin, LI Xin, TANG Mingqiang, ZHAO Fang. Influence of hot-pressed sintering temperature on properties of SiCp/Al composites[J]. Diamond & Abrasives Engineering, 2023, 43(5): 546-552. doi: 10.13394/j.cnki.jgszz.2022.0105 |
[7] | CAO Guixin, DONG Zhiguo, ZHANG Zehua, HOU Zhangmin. Model construction and experimental research on end grinding force of SiCp/Al composites[J]. Diamond & Abrasives Engineering, 2023, 43(3): 340-347. doi: 10.13394/j.cnki.jgszz.2022.0112 |
[8] | KANG Huiyuan, KANG Aolong, JIAO Zengkai, WANG Xi, ZHOU Kechao, MA Li, DENG Zejun, WANG Yijia, YU Zhiming, WEI Qiuping. Configuration design and thermal conductivity of diamond-SiC/Al composites[J]. Diamond & Abrasives Engineering, 2022, 42(5): 527-534. doi: 10.13394/j.cnki.jgszz.2022.0015 |
[9] | SUN Baoyu, FU Xingbao, YUAN Xu, GU Yan. Research on ultrasonic vibration grinding technology of SiCp/Al composites[J]. Diamond & Abrasives Engineering, 2022, 42(6): 713-719. doi: 10.13394/j.cnki.jgszz.2022.0016 |
[10] | ZHANG Haitao, BAO Yan, YANG Feng, SUN Haiqi, DONG Zhigang, KANG Renke. Ultrasonic assisted helical grinding of SiCf/SiC ceramic matrix composites[J]. Diamond & Abrasives Engineering, 2022, 42(1): 81-87. doi: 10.13394/j.cnki.jgszz.2021.0107 |
[11] | GAO Wei, ZHANG Yinxia, HUANG Pengju. Study on material removal mechanism of 6H-SiC single crystal wafer based on different nano-scratch order[J]. Diamond & Abrasives Engineering, 2021, 41(4): 92-97. doi: 10.13394/j.cnki.jgszz.2021.4.0013 |
[12] | HAN Lu, KANG Renke, ZHANG Yuan, DONG Zhigang, BAO Yan. Research on surface integrity of GH4169 machined by ultrasonic assisted grinding[J]. Diamond & Abrasives Engineering, 2021, 41(5): 46-51. doi: 10.13394/j.cnki.jgszz.2021.5.0008 |
[13] | ZHOU Wenwen, WANG Jianqing, ZHAO Jing, LIU Yao. Experimental research on single abrasive grain scratch SiCf/SiC ceramic matrix composite[J]. Diamond & Abrasives Engineering, 2021, 41(1): 51-57. doi: 10.13394/j.cnki.jgszz.2021.1.0009 |
[14] | XU Luxin, LI Hua, CAI Xiaotong, ZHOU Peixiang, CHEN Yiwen, WU Jiafu. Study on surface quality in ultrasonic vibration grinding of SiC ceramics with small diameter grinding wheel[J]. Diamond & Abrasives Engineering, 2020, 40(2): 67-77. doi: 10.13394/j.cnki.jgszz.2020.2.0012 |
[15] | DING Kai, LI Qilin, SU Honghua, CHEN Yurong. Study status and future prospects on ultrasonic assisted grinding of hard and brittle materials[J]. Diamond & Abrasives Engineering, 2020, 40(1): 5-14. doi: 10.13394/j.cnki.jgszz.2020.1.0001 |
[16] | YUAN Dongfang, ZOU Qin, LI Yanguo, WANG Mingzhi. Study on wear resistance of Ti3SiC2 composite materials[J]. Diamond & Abrasives Engineering, 2019, 39(6): 30-38. doi: 10.13394/j.cnki.jgszz.2019.6.0006 |
[17] | LI Long, GE Peiqi, WANG Peizhi, LI Zongqiang. Abrasive machining simulation technology for hard-brittle materials[J]. Diamond & Abrasives Engineering, 2019, 39(3): 81-87. doi: 10.13394/j.cnki.jgszz.2019.3.0013 |
[18] | ZHENG Weishuai, KANG Renke, LIU Jinting, ZHAO Fan, DONG Zhigang. Development of special generator for ultrasonic assisted grinding[J]. Diamond & Abrasives Engineering, 2018, 38(6): 86-91. doi: 10.13394/j.cnki.jgszz.2018.6.0016 |
[19] | SHEN Long, DING Wenfeng, LI Zheng, XIAO Hong, WANG Xunyang. Research on grinding temperature of particle-reinforced titanium matrix composites in creep-feed deep grinding[J]. Diamond & Abrasives Engineering, 2016, 36(4): 44-48. doi: 10.13394/j.cnki.jgszz.2016.4.0009 |
[20] | CAO Youwei, QIAO Guochao. Simulation method of grinding wheel topography[J]. Diamond & Abrasives Engineering, 2016, 36(3): 33-37. doi: 10.13394/j.cnki.jgszz.2016.3.0007 |