Manufacturing technique and industry status of semiconductor silicon wafers

YAN Zhirui; KU Liming; BAI Dujuan; CHEN Haibin; WANG Yongtao

doi:10.13394/j.cnki.jgszz.2020.4.0001

Volume 40 Issue 4

Aug. 2020

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YAN Zhirui, KU Liming, BAI Dujuan, CHEN Haibin, WANG Yongtao. Manufacturing technique and industry status of semiconductor silicon wafers[J]. Diamond & Abrasives Engineering, 2020, 40(4): 5-11. doi: 10.13394/j.cnki.jgszz.2020.4.0001

Citation:

YAN Zhirui, KU Liming, BAI Dujuan, CHEN Haibin, WANG Yongtao. Manufacturing technique and industry status of semiconductor silicon wafers[J]. Diamond & Abrasives Engineering, 2020, 40(4): 5-11. doi: 10.13394/j.cnki.jgszz.2020.4.0001

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Manufacturing technique and industry status of semiconductor silicon wafers

doi: 10.13394/j.cnki.jgszz.2020.4.0001

GRINM Semiconductor Materials Co., Ltd., Beijing 100088, China

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Rev Recd Date: 2020-08-09

Abstract

Abstract

Based on the introduction of the basic theory and manufacturing technique of semiconductor silicon wafers, this article analyzes the current global industry situation, industrial development trends and characteristics of silicon wafers. It then discusses, based on the actual situation, the opportunities, the challenges and the existing problems to develop silicon industry in China.
- semiconductor,
- silicon wafer,
- industry status,
- technique,
- opportunity,
- challenge