[1] | TANG Ailing, YUAN Zewei, TANG Meiling, WANG Ying. Effect of abrasive vibration on microstructure evolution and material removal of SiC CMP[J]. Diamond & Abrasives Engineering, 2024, 44(1): 109-122. doi: 10.13394/j.cnki.jgszz.2023.0053 |
[2] | QIU Xiaolong, SUN Xingwei, LIU Yin, YANG Heran, DONG Zhixu, ZHANG Weifeng. Simulation experimental on material removal mechanism of ITO conductive glass by single abrasive[J]. Diamond & Abrasives Engineering, 2024, 44(3): 354-362. doi: 10.13394/j.cnki.jgszz.2023.0183 |
[3] | XU Pengchong, SUN Yuli, ZHANG Guiguan, KANG Shijie, LU Wenzhuang, SUN Yebin, ZUO Dunwen. Comparison of erosion resistance of hard and brittle materials processed by low-temperature micro-abrasive gas jet[J]. Diamond & Abrasives Engineering, 2024, 44(5): 665-674. doi: 10.13394/j.cnki.jgszz.2023.0220 |
[4] | WEN Jiazhou, WANG Qingxia, YU Aiwu, WU Chongjun. Removal mechanism of unidirectional Cf/SiC composites based on single diamond grit scratching[J]. Diamond & Abrasives Engineering, 2024, 44(3): 327-334. doi: 10.13394/j.cnki.jgszz.2023.0104 |
[5] | LI Dengchao, ZHANG Pingkuan, LI Shunshun. Design and simulation analysis of rust removal grinding block on inner wall of elbow at constant pressure[J]. Diamond & Abrasives Engineering, 2022, 42(2): 248-254. doi: 10.13394/j.cnki.jgszz.2021.0118 |
[6] | LI Kaixuan, LI Jun, XIONG Guanghui, WU Cheng, YU Ningbin, GAO Xiujuan. Flatness prediction of single pendulum polishing based on microelement material removal model[J]. Diamond & Abrasives Engineering, 2022, 42(2): 208-215. doi: 10.13394/j.cnki.jgszz.2021.0116 |
[7] | ZHANG Haitao, BAO Yan, YANG Feng, SUN Haiqi, DONG Zhigang, KANG Renke. Ultrasonic assisted helical grinding of SiCf/SiC ceramic matrix composites[J]. Diamond & Abrasives Engineering, 2022, 42(1): 81-87. doi: 10.13394/j.cnki.jgszz.2021.0107 |
[8] | HUANG Shuiquan, GAO Shang, HUANG Chuanzhen, HUANG Han. Nanoscale removal mechanisms in abrasive machining of brittle solids[J]. Diamond & Abrasives Engineering, 2022, 42(3): 257-267. doi: 10.13394/j.cnki.jgszz.2021.3009 |
[9] | HU Zhijie, CAO Shiyu, HUANG Wenjian, WU Chaoqun. Material removal depth model of titanium alloy ground by flap wheel[J]. Diamond & Abrasives Engineering, 2021, 41(6): 18-23. doi: 10.13394/j.cnki.jgszz.2021.6.0004 |
[10] | KANG Xijun, TAMAKI Junichi, AKIHIKO Kubo, QIU Yirui, HUANG Peng. ECD truing/dressing and cutting edge truncation of diamond grinding wheel and its processing of hard and brittle materials[J]. Diamond & Abrasives Engineering, 2021, 41(3): 12-18. doi: 10.13394/j.cnki.jgszz.2021.3.0002 |
[11] | GAO Wei, ZHANG Yinxia, HUANG Pengju. Study on material removal mechanism of 6H-SiC single crystal wafer based on different nano-scratch order[J]. Diamond & Abrasives Engineering, 2021, 41(4): 92-97. doi: 10.13394/j.cnki.jgszz.2021.4.0013 |
[12] | SONG Yu, MENG Guangyao, GAO Zhiyang, SHEN Yisong. Simulation analysis of stress field and temperature field of cutting blades based on laser ranging and positioning[J]. Diamond & Abrasives Engineering, 2020, 40(6): 70-75. doi: 10.13394/j.cnki.jgszz.2020.6.0012 |
[13] | JIA Xiaofeng, ZHAO Bo. Design and application of large load amplitude transformer in ELID compound internal grinding system assisted by ultrasonic vibration[J]. Diamond & Abrasives Engineering, 2020, 40(1): 15-23. doi: 10.13394/j.cnki.jgszz.2020.1.0002 |
[14] | DING Kai, LI Qilin, SU Honghua, CHEN Yurong. Study status and future prospects on ultrasonic assisted grinding of hard and brittle materials[J]. Diamond & Abrasives Engineering, 2020, 40(1): 5-14. doi: 10.13394/j.cnki.jgszz.2020.1.0001 |
[15] | KANG Renke, ZHAO Fan, BAO Yan, ZHU Xianglong, DONG Zhigang. Ultrasonic assisted grinding of SiCf/SiC composites[J]. Diamond & Abrasives Engineering, 2019, 39(4): 85-91. doi: 10.13394/j.cnki.jgszz.2019.4.0015 |
[16] | CAO Zhihe, LIN Bin, ZHOU Ping, KANG Renke. Analysis on numerical prediction models of surface topography in rotational grinding[J]. Diamond & Abrasives Engineering, 2018, 38(3): 58-63. doi: 10.13394/j.cnki.jgszz.2018.3.0012 |
[17] | LIN Bin, CAO Zhihe, ZHOU Ping, KANG Renke. Analysis on model of grain depth-of-cut of wafer rotational grinding[J]. Diamond & Abrasives Engineering, 2018, 38(2): 89-93. doi: 10.13394/j.cnki.jgszz.2018.2.0018 |
[18] | MA Xinyi. Grinding force of two-dimensional ultrasonic-ELID composite grinding system[J]. Diamond & Abrasives Engineering, 2017, 37(1): 66-69,73. doi: 10.13394/j.cnki.jgszz.2017.1.0013 |
[19] | DENG Hui, DENG Chaohui. Progress on dressing technology of monolayer brazed diamond grinding wheel[J]. Diamond & Abrasives Engineering, 2017, 37(3): 29-34. doi: 10.13394/j.cnki.jgszz.2017.3.0007 |
[20] | TONG Haocheng, LI Jun, GUO Taiyu, MING Shun, ZHU Yongwei, ZUO Dunwen. Research on the relationship between acoustic emission signal and material removal rate during fixed abrasive lapping[J]. Diamond & Abrasives Engineering, 2017, 37(5): 19-23. doi: 10.13394/j.cnki.jgszz.2017.5.0003 |