Simulation analysis of stress field and temperature field of cutting blades based on laser ranging and positioning

SONG Yu; MENG Guangyao; GAO Zhiyang; SHEN Yisong

doi:10.13394/j.cnki.jgszz.2020.6.0012

Volume 40 Issue 6

Dec. 2020

Turn off MathJax

Article Contents

Abstract

References

Article Navigation > Diamond & Abrasives Engineering > 2020 > 40(6): 70-75

SONG Yu, MENG Guangyao, GAO Zhiyang, SHEN Yisong. Simulation analysis of stress field and temperature field of cutting blades based on laser ranging and positioning[J]. Diamond & Abrasives Engineering, 2020, 40(6): 70-75. doi: 10.13394/j.cnki.jgszz.2020.6.0012

Citation:

SONG Yu, MENG Guangyao, GAO Zhiyang, SHEN Yisong. Simulation analysis of stress field and temperature field of cutting blades based on laser ranging and positioning[J]. Diamond & Abrasives Engineering, 2020, 40(6): 70-75. doi: 10.13394/j.cnki.jgszz.2020.6.0012

Citation:

PDF( 1671 KB)

Simulation analysis of stress field and temperature field of cutting blades based on laser ranging and positioning

doi: 10.13394/j.cnki.jgszz.2020.6.0012

School of Mechanical and Automotive Engineering, Qingdao University of Technology, Qingdao 266520, Shandong, China

More Information

Rev Recd Date: 2020-09-12

Available Online: 2022-04-06

Abstract

Abstract

In the automatic cutting process of casting pouring riser, the diameter of the grinding wheel is gradually reduced due to wear, which affects the positioning accuracy of the cutting process. Based on the laser distance meter, a method for automatic positioning by measuring the remaining diameter of the cutting blade after wear is proposed. ABAQUS finite element analysis software is used to design single-factor experiments to analyze the stress and temperature field before and after increasing the thickness of the cutting blade. The results of the study show that properly increasing the thickness of the cutting sheet is beneficial to avoid stress concentration and reduce the cutting temperature, and it is found that the surface morphology of the workpiece improved after the thickness of the cutting disc is increased.
- laser ranging and positioning,
- thickness of cutting blade,
- ABAQUS,
- stress field simulation,
- temperature field simulation

FullText(HTML)

References(0)

References

Relative Articles

[2]	YANG Tiantian, HUANG Kai. Effect of thickness of polycrystalline diamond layer and diameter of compact on residual thermal stress of PDC[J]. Diamond & Abrasives Engineering, 2024, 44(6): 744-751. doi: 10.13394/j.cnki.jgszz.2023.0201
[3]	CHEN Jiahu, GE Peiqi. Simulation study of cutting fluid flow field in kerf of fine diameter diamond wire saw[J]. Diamond & Abrasives Engineering, 2024, 44(6): 781-788. doi: 10.13394/j.cnki.jgszz.2023.0235
[4]	YANG Haixia, FU Mingjiang, LUO Jian, ZHANG Tao. Simulation optimization of physical field of diamond particles deposited by multi-piece substrates HFCVD system[J]. Diamond & Abrasives Engineering, 2023, 43(6): 735-742. doi: 10.13394/j.cnki.jgszz.2023.0031
[5]	HUANG Fenping, SHU Xiayun, XU Weijing, CHANG Xuefeng. Simulation and experimental study of single-crystal silicon laser assisted cutting based on SPH method[J]. Diamond & Abrasives Engineering, 2023, 43(6): 727-734. doi: 10.13394/j.cnki.jgszz.2023.0025
[6]	HE Yan, LI Xiang, GAO Xingjun, FAN Lin, LIU Ming, XU Zicheng. Modeling of ultra-thin diamond slice and simulation of SiC wafer cutting based on Python language[J]. Diamond & Abrasives Engineering, 2023, 43(5): 621-631. doi: 10.13394/j.cnki.jgszz.2003.0001
[7]	CHENG Shuting, WANG Hongbo, JI Hui, CAI Maosheng, LI Sai. Experimental study on optimization of PDC cutting teeth for conglomerate layer[J]. Diamond & Abrasives Engineering, 2023, 43(1): 43-48. doi: 10.13394/j.cnki.jgszz.2022.0072
[8]	ZOU Qin, ZHANG Chengxiang, LI Yanguo, LI Kenan. Research present situation of machining deformation of ultra-thin dicing blades[J]. Diamond & Abrasives Engineering, 2022, 42(1): 119-128. doi: 10.13394/j.cnki.jgszz.2021.0102
[9]	ZHANG Lan, SONG Wentao, LI Na, MA Huizhong. Preparation and properties of nickel-boron-diamond ultrathin dicing blades[J]. Diamond & Abrasives Engineering, 2021, 41(5): 77-83. doi: 10.13394/j.cnki.jgszz.2021.5.0013
[10]	JIANG Peijun. Three dimensional simulation and experiment of plane grinding temperature field based on temperature matching method[J]. Diamond & Abrasives Engineering, 2020, 40(5): 96-101. doi: 10.13394/j.cnki.jgszz.2020.05.0017
[11]	DENG Fuming, WANG Shuang, GUO Zhenhai, HAO Cen, ZHAO Xin, XIE Yajuan, XU Chenyang. Effect of matrix surface temperature field on deposition of nano-diamond films based on ANSYS simulation[J]. Diamond & Abrasives Engineering, 2020, 40(3): 33-39. doi: 10.13394/j.cnki.jgszz.2020.3.0005
[12]	YAN Xinlin, XIAO Bo, WU Hengheng, XIAO Bing, ZHANG Yiquan. Research on grinding temperature field of rail grinding with compound wheel[J]. Diamond & Abrasives Engineering, 2020, 40(2): 11-16. doi: 10.13394/j.cnki.jgszz.2020.2.0002
[13]	XI Xinxin, CHEN Tao, DING Wenfeng. Research on temperature field during grinding of low-pressure turbine blade tenon of TiAl alloys[J]. Diamond & Abrasives Engineering, 2020, 40(5): 17-22. doi: 10.13394/j.cnki.jgszz.2020.5.0003
[14]	WANG Wenxi, LI Jianyong, WU Yuan, FAN Wengang. Experimental and simulation investigation into residual stress for rail grinding with abrasive belt[J]. Diamond & Abrasives Engineering, 2020, 40(3): 5-12. doi: 10.13394/j.cnki.jgszz.2020.3.0001
[15]	QIAN Yizheng, ZHANG Tao, WANG Shu, CHEN Dakui, HUANG Guodong. Simulation and optimization of temperature field of diamond coated tools deposited by HFCVD method based on heat dissipation at tool bottom[J]. Diamond & Abrasives Engineering, 2020, 40(3): 40-45. doi: 10.13394/j.cnki.jgszz.2020.3.0006
[16]	SHAO Weifan. Analysis of turning temperature field of titanium alloy based on nanofluid cooling[J]. Diamond & Abrasives Engineering, 2019, 39(5): 97-102. doi: 10.13394/j.cnki.jgszz.2019.5.0017
[17]	LIU Baochang, CAO Xin, JI Shengli, HAN Zhe, ZHAO Xinzhe, LI Siqi. Simulation and experimental research on flow field andtemperature field of diamond impregnated drill bit[J]. Diamond & Abrasives Engineering, 2018, 38(5): 33-38. doi: 10.13394/j.cnki.jgszz.2018.5.0007
[18]	HE Yuhui, FENG Ke, TANG Chu, TANG Jinyuan. Model of temperature field on ground surface based on grinding force[J]. Diamond & Abrasives Engineering, 2018, 38(3): 64-69. doi: 10.13394/j.cnki.jgszz.2018.3.0013
[19]	JIAN Xiaogang, LEI Qiang, ZHANG Kuilin. Optimization of HFCVD diamond coating deposition temperature compensating[J]. Diamond & Abrasives Engineering, 2016, 36(6): 15-19,24. doi: 10.13394/j.cnki.jgszz.2016.6.0004
[20]	WANG Yong, SUN Yuli, TANG Suyang, LIU Zhigang, ZUO Dunwen. Simulation of temperature field when polishing germanium wafer using ice-bonded-abrasive polishing pad[J]. Diamond & Abrasives Engineering, 2016, 36(3): 17-22. doi: 10.13394/j.cnki.jgszz.2016.3.0004

Supplements(0)

Cited By

Proportional views

Proportional views

通讯作者: 陈斌, bchen63@163.com

1.
沈阳化工大学材料科学与工程学院沈阳 110142

Get Citation

PDF

XML

Article Metrics

Article views (445) PDF downloads(11)

Simulation analysis of stress field and temperature field of cutting blades based on laser ranging and positioning

doi: 10.13394/j.cnki.jgszz.2020.6.0012

Abstract

References

Relative Articles

Proportional views

Catalog

通讯作者: 陈斌, bchen63@163.com

Article Metrics

Proportional views

Related

Simulation analysis of stress field and temperature field of cutting blades based on laser ranging and positioning

doi: 10.13394/j.cnki.jgszz.2020.6.0012

Abstract

References

Relative Articles

Proportional views

Catalog

通讯作者: 陈斌, bchen63@163.com

Article Metrics

Proportional views

Related

Export File

Citation

Format

Content