基于Bi2O3-B2O3体系的陶瓷结合剂金刚石砂轮制备及其对单晶硅的磨削性能

白福厚; 廖燕玲; 轩闯; 张凤林

doi:10.13394/j.cnki.jgszz.2022.0137

基于Bi₂O₃-B₂O₃体系的陶瓷结合剂金刚石砂轮制备及其对单晶硅的磨削性能

doi: 10.13394/j.cnki.jgszz.2022.0137

广东工业大学机电工程学院, 广州 510006

基金项目: 广东省珠江本土创新团队项目（2017BT01C169），佛山市核心技术攻关项目（ 1920001000361）。

详细信息

通讯作者:
张凤林，男，1972年生，教授。主要研究方向：难加工材料的磨削加工以及超硬材料制品。E-mail：zhangfl@gdut.edu.cn

中图分类号: TQ153
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出版历程
- 收稿日期: 2022-08-26
- 修回日期: 2022-12-04
- 录用日期: 2022-12-28
- 刊出日期: 2023-08-30

Preparation of vitrified bond diamond wheel based on Bi₂O₃-B₂O₃ glass system and its grinding performance on monocrystalline silicon

School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou 510006, China

摘要

摘要: 针对陶瓷结合剂烧结温度高的问题，提出一种基于Bi₂O₃-B₂O₃的新型低温陶瓷结合剂。分析添加纳米SiC和纳米ZrO₂对结合剂物相组成、流动性和力学性能的影响，并探索添加核桃壳粉造孔剂对金刚石砂轮微观形貌的影响；制备基于Bi₂O₃-B₂O₃体系的陶瓷结合剂金刚石杯形砂轮，测试其对单晶硅晶圆片的磨削性能。结果表明：添加纳米SiC会导致陶瓷结合剂中出现一定量的Bi单质，破坏结合剂的[BiO₄]玻璃网络；添加纳米SiC及纳米ZrO₂后，结合剂的流动性降低；随烧结温度上升，结合剂的流动性、抗弯强度和硬度有增大的趋势，在560 ℃烧结时结合剂的抗弯强度和硬度达到最大。随着造孔剂含量的增大，砂轮中大气孔的数量显著增多、尺寸显著增大。在砂轮线速度为12.56 m/s，工件转速为5.23 m/s，进给速度为0.1 μm/s条件下，使用以M10/20金刚石（粒度号为800目）制备的砂轮磨削加工单晶硅晶圆片，其磨削比为790，表面粗糙度为0.16 μm。
- 陶瓷结合剂金刚石砂轮 /
- 单晶硅晶圆片 /
- 力学性能 /
- 磨削性能
Abstract: To solve the problem of high sintering temperature of vitrified bond, a novel low- temperature vitrified bond based on Bi₂O₃-B₂O₃ glass system was proposed. The effect of nano-SiC and nano-ZrO₂ on the phase composition, fluidity and mechanical properties of the vitrified bond were analyzed. Additionally, the effect of adding walnut shell powder as a pore-forming agent on the microstructure of the vitrified bond diamond grinding wheel was explored. A vitrified bond diamond cup grinding wheel based on Bi₂O₃-B₂O₃ glass system was prepared, and its grinding performance on monocrystalline silicon wafer was tested. The results show that adding nano-SiC powder leads to the formation of Bi in the vitrified bond and destroys the [BiO₄] glass network of vitrified bond. The fluidity of the vitrified bond decreases with the addition of nano-SiC and nano- ZrO₂. Furthermore, the fluidity, flexural strength and hardness of the vitrified bond increase as the sintering temperature increases. The flexural strength and the hardness of the vitrified bond reach to their highest value at 560 ℃. With the increase of the content of the pore-forming agent, the amount of large pores in the grinding wheel increases significantly and the size becomes larger. The prepared Bi₂O₃-B₂O₃ vitrified bond diamond cup grinding wheel (800 mesh or M10/20) was used to grind monocrystalline silicon wafer under specific conditions (linear speed: 12.56 m/s, workpiece speed: 5.23 m/s, and feed speed: 0.1 μm/s). The grinding ratio reaches 790, and the surface roughness of the monocrystalline silicon wafer is 0.16 μm.
- vitrified bond diamond grinding wheel /
- monocrystalline silicon wafer /
- mechanical property /
- grinding performance

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图 1 陶瓷结合剂微观形貌

Figure 1. Microstructure of vitrified bond

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图 2 陶瓷结合剂金刚石砂轮烧结温度曲线

Figure 2. Sintering temperature curve of vitrified bond diamond grinding wheel

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图 3 砂轮长条试样

Figure 3. Sintered specimen

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图 4 陶瓷结合剂金刚石杯形砂轮

Figure 4. Vitrified bond diamond cup grinding wheel

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图 5 Bi₂O₃-B₂O₃陶瓷结合剂和添加纳米SiC和纳米ZrO₂后的XRD图谱

Figure 5. XRD patterens of pure Bi₂O₃-B₂O₃vitrified bond or bonds containing nano-Si or nano- ZrO₂

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图 6 陶瓷结合剂BSE图

Figure 6. BSE image of vitrified bond

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图 7 烧结温度对不同Bi₂O₃-B₂O₃陶瓷结合剂的流动性的影响

Figure 7. Effect of sintering temperature on fluidity of Bi₂O₃-B₂O₃ vitrified bonds with different compositions

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图 8 烧结温度对不同Bi₂O₃-B₂O₃陶瓷结合剂的抗弯强度的影响

Figure 8. Effect of sintering temperature on flexural strength of Bi₂O₃-B₂O₃vitrified bond with different compositions

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图 9 烧结温度对不同Bi₂O₃-B₂O₃陶瓷结合剂的维氏硬度的影响

Figure 9. Effect of sintering temperature on vickers hardness of Bi₂O₃-B₂O₃vitrified bond with different compositions

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图 10 560 ℃下烧结添加质量分数为(a) 1% (b) 2% (c) 3%的造孔剂后砂轮断面微观形貌

Figure 10. Microstructure of grinding wheel sintered at 560 ℃ with mass fractions of pore former: (a) 1% (b) 2% (c) 3%

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图 11 单晶硅晶圆片磨削加工示意图

Figure 11. Schematic diagram of grinding monocrystalline silicon wafer

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图 12 基于Bi₂O₃-B₂O₃体系的陶瓷结合剂金刚石砂轮在不同参数下磨削单晶硅晶圆片的磨削比

Figure 12. Grinding ratios of grinding monocrystalline silicon wafer with Bi₂O₃-B₂O₃vitrified bond grinding wheel under different parameters

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图 13 基于Bi₂O₃-B₂O₃体系的陶瓷结合剂金刚石砂轮在不同参数下磨削单晶硅的表面粗糙度

Figure 13. Surface roughness of monocrystalline silicon wafer ground by Bi₂O₃-B₂O₃vitrified bond grinding wheel under different parameters

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图 14 工件转速为3.14 m/s时单晶硅的表面形貌

Figure 14. Surface morphologies of silicon wafer rotating at 3.14 m/s

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图 15 工件转速为5.23 m/s时单晶硅的表面形貌

Figure 15. Surface morphologies of silicon wafer rotating at 5.23 m/s

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表 1 Bi₂O₃-B₂O₃陶瓷结合剂成分

Table 1. Composition of Bi₂O₃-B₂O₃vitrified bond

编号	Bi₂O₃ 物质的量分数 N₁ / %	B₂O₃ 物质的量分数 N₂ / %	SiO₂ 物质的量分数 N₃ / %	Al₂O₃ 物质的量分数 N₄ / %	额外添加（质量分数）
A1	40	40	10	10	无
A2	40	40	10	10	5%纳米SiC （100 nm）
A3	40	40	10	10	5%纳米ZrO （100 nm）₂

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表 2 陶瓷结合剂金刚石砂轮配方

Table 2. Formula of vitrified bond diamond grinding wheel

序号	金刚石质量分数 w_d / %	绿碳化硅质量分数 w_s / %	结合剂质量数 w_b / %	造孔剂质量分数 w_p / %
1	35	35	29	1
2	35	34	29	2
3	35	33	29	3

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