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钎焊金刚石磨粒钻钻削C/SiC陶瓷基复合材料孔时切屑对钻削过程的影响

邵国栋 史振宇

邵国栋, 史振宇. 钎焊金刚石磨粒钻钻削C/SiC陶瓷基复合材料孔时切屑对钻削过程的影响[J]. 金刚石与磨料磨具工程, 2022, 42(3): 348-355. doi: 10.13394/j.cnki.jgszz.2021.0212
引用本文: 邵国栋, 史振宇. 钎焊金刚石磨粒钻钻削C/SiC陶瓷基复合材料孔时切屑对钻削过程的影响[J]. 金刚石与磨料磨具工程, 2022, 42(3): 348-355. doi: 10.13394/j.cnki.jgszz.2021.0212
SHAO Guodong, SHI Zhenyu. Effect of chips on drilling process when drilling C/SiC ceramic matrix composite holes with brazed diamond abrasive drill[J]. Diamond &Abrasives Engineering, 2022, 42(3): 348-355. doi: 10.13394/j.cnki.jgszz.2021.0212
Citation: SHAO Guodong, SHI Zhenyu. Effect of chips on drilling process when drilling C/SiC ceramic matrix composite holes with brazed diamond abrasive drill[J]. Diamond &Abrasives Engineering, 2022, 42(3): 348-355. doi: 10.13394/j.cnki.jgszz.2021.0212

钎焊金刚石磨粒钻钻削C/SiC陶瓷基复合材料孔时切屑对钻削过程的影响

doi: 10.13394/j.cnki.jgszz.2021.0212
基金项目: 国家自然科学基金(51975334,U21A20134);山东大学齐鲁青年学者计划;山东省军民科技融合重点研发计划(2019JMRH0407)
详细信息
    通讯作者:

    史振宇,女,1984年生,教授、博士生导师。主要研究方向:复合材料加工技术。E-mail:shizhenyu@sdu.edu.cn

  • 中图分类号: TG74; TG58; TQ164

Effect of chips on drilling process when drilling C/SiC ceramic matrix composite holes with brazed diamond abrasive drill

  • 摘要: 钎焊金刚石磨粒钻适合钻削碳纤维增强碳化硅陶瓷基复合材料孔,但大量切屑会对孔的钻削过程产生不利影响。为此,针对切屑排出过程,分析切屑形貌,研究钻削时切屑对轴向钻削力、孔加工质量、钻头磨损的影响。结果表明:切屑对轴向钻削力有影响,尤其钻削深孔时影响显著。切屑对孔进口的加工质量几乎没有影响,只表现为孔进口处的轻微崩边;切屑对孔出口的加工质量影响显著,可引起严重的纤维断裂、撕裂缺陷以及基体的大区域脱落。同时,切屑加剧钻头磨损,使钻头不仅出现崩刃、微裂纹等轻微磨损,而且还产生基体剥落、金刚石剥落等严重磨损行为。

     

  • 图  1  麻花钻及钎焊金刚石磨粒钻钻削加工时切屑的产生及运动路线

    Figure  1.  Generation and movement path of chips during drilling with twist drill and brazed diamond abrasive drill

    图  2  C/SiC的SEM形貌和EDX分析图

    Figure  2.  SEM morphology and EDX analysis of C/SiC

    图  3  C/SiC陶瓷基复合材料的XRD分析

    Figure  3.  XRD analysis of C/SiC ceramic matrix composite

    图  4  钻头形貌

    Figure  4.  Drill morphology

    图  5  实验设计

    Figure  5.  Experimental design

    图  6  切屑的SEM形貌

    Figure  6.  SEM morphology of chips

    图  7  对照组和实验组的钻削力

    Figure  7.  Drilling forces of control group and experimental group

    图  8  孔进口形貌

    Figure  8.  Morphology of hole inlet

    图  9  孔出口形貌

    Figure  9.  Morphology of hole outlet

    图  10  对照组钻削10个1/2孔后的钻头形貌

    Figure  10.  Drill morphology after drilling 10 1/2 holes in the control group

    图  11  实验组钻削5个全孔后的钻头形貌

    Figure  11.  Drill morphology after drilling 5 full holes in the experimental group

    表  1  C/SiC的力学和物理性能参数

    Table  1.   Mechanical and physical properties of C/SiC

    参数取值
    密度 ρ / (g·cm−31.9
    孔隙率 φ / %5
    拉伸强度 σ1 / MPa87.5
    压缩强度 σ2 / MPa460
    弯曲强度 σ3 / MPa260
    弹性模量 E / GPa40
    层间剪切强度 σ4 / MPa20
    断裂韧性 KIC / (MPa·m1/2)10
    SiC基体硬度 H / GPa22.2
    下载: 导出CSV
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出版历程
  • 收稿日期:  2021-12-29
  • 修回日期:  2022-03-08

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