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微结构砂轮对不同陶瓷的磨削性能

廖燕玲 张凤林 李凯江 伍尚华

廖燕玲, 张凤林, 李凯江, 伍尚华. 微结构砂轮对不同陶瓷的磨削性能[J]. 金刚石与磨料磨具工程, 2022, 42(3): 290-299. doi: 10.13394/j.cnki.jgszz.2021.0204
引用本文: 廖燕玲, 张凤林, 李凯江, 伍尚华. 微结构砂轮对不同陶瓷的磨削性能[J]. 金刚石与磨料磨具工程, 2022, 42(3): 290-299. doi: 10.13394/j.cnki.jgszz.2021.0204
LIAO Yanling, ZHANG Fenglin, LI Kaijiang, WU Shanghua. Grinding performance of micro-texured grinding wheel on different ceramic materials[J]. Diamond &Abrasives Engineering, 2022, 42(3): 290-299. doi: 10.13394/j.cnki.jgszz.2021.0204
Citation: LIAO Yanling, ZHANG Fenglin, LI Kaijiang, WU Shanghua. Grinding performance of micro-texured grinding wheel on different ceramic materials[J]. Diamond &Abrasives Engineering, 2022, 42(3): 290-299. doi: 10.13394/j.cnki.jgszz.2021.0204

微结构砂轮对不同陶瓷的磨削性能

doi: 10.13394/j.cnki.jgszz.2021.0204
基金项目: 国家自然科学基金(51775118);佛山市核心技术攻关项目(1920001000361);广州市对外科技合作项目(201907010022);广东省珠江本土创新团队项目(2017BT01C169)。
详细信息
    作者简介:

    廖燕玲,女,1997年出生,博士研究生。主要研究方向为陶瓷精密磨削机理研究。E-mail:1009219842@qq.com

    通讯作者:

    张凤林,男,1972年出生,博士、教授、博士研究生导师。主要研究方向为难加工材料的精密磨削加工技术,超硬材料工具设计与制造。E-mail:zhangfl@gdut.edu.cn

  • 中图分类号: TG74

Grinding performance of micro-texured grinding wheel on different ceramic materials

  • 摘要: 基于阵列微孔的微结构砂轮和普通砂轮对氧化铝、氮化铝、氧化锆及氮化硅陶瓷材料的不同磨削性能,对比研究不同砂轮和不同陶瓷材料的磨削力、比磨削能、表面粗糙度及表面崩边特征。结果表明:相比普通砂轮,微结构砂轮提高了氧化铝、氮化铝及氧化锆陶瓷的磨削力和比磨削能,降低了表面粗糙度,而对氮化硅陶瓷的磨削力及表面粗糙度影响不明显;相比其他陶瓷,氮化硅陶瓷具有较高的磨削力和比磨削能。从磨削加工表面特征上看,氧化铝、氮化铝陶瓷以脆性去除方式为主,氧化锆以塑性去除为主,而氮化硅则兼具塑性和脆性去除特征;微结构砂轮加工表面崩边尺寸大于普通砂轮的崩边尺寸,氧化铝和氮化铝陶瓷的表面崩边尺寸明显大于氧化锆和氮化硅陶瓷的。

     

  • 图  1  磨削加工示意图

    (a)磨床设备;(b)微结构砂轮;(c)表面崩边尺寸测量

    Figure  1.  Grinding schematic diagram

    (a) Grinding equipment; (b) Micro-textured grinding wheel; (c) Surface chipping thickness measurement

    图  2  不同进给速率下的磨削力

    Figure  2.  Grinding force under different feed rates

    图  3  不同磨削深度下的磨削力

    Figure  3.  Grinding force under different grinding depth

    图  4  不同陶瓷材料的$\left( {K_{{\rm{IC}}}^{1/2}H} \right)/{E^{2/5}}$

    Figure  4.  $\left( {K_{{\rm{IC}}}^{1/2}H} \right)/{E^{2/5}}$ value of different ceramic materials

    图  5  比磨削能随$ {\mathit{h}}_{\rm{m}} $的变化

    Figure  5.  Change of specific grinding energy with $ {\mathit{h}}_{\rm{m}} $

    图  6  不同磨削参数下表面粗糙度

    Figure  6.  Surface roughness under different grinding parameters

    图  7  不同陶瓷材料的表面微观形貌

    Figure  7.  Surface morphology of different ceramic materials

    图  8  微结构砂轮降低ZrO2表面粗糙度的原理示意图

    Figure  8.  schematic diagram of micro-textured grinding wheel for reducing the surface roughness of ZrO2

    图  9  不同陶瓷材料的崩边尺寸Ct以及临界切深dc的关系

    Figure  9.  Relationship between chipping thickness Ct and critical cutting depth dc of different ceramic materials

    ( vs=10.47 m/s, vw=7.5 m/min, ap=10 μm)

    图  10  不同陶瓷材料的表面崩边形貌与尺寸

    Figure  10.  Morphology and thickness of the surface chipping on different ceramic materials

    表  1  陶瓷材料的理化性能及用途

    Table  1.   Physical and chemical properties of ceramic materials and their applications

    陶瓷化学键晶体结构性能用途
    Al2O3离子键六方晶系硬度高,抗热振性和抗氧化性好[30]陶瓷结构件,电子基板,耐火材料等
    AlN共价键六方纤锌矿结构[31]导热率高,绝缘性好,介电常数低,抗腐蚀性好
    以及与硅相近的热膨胀系数[32]
    集成电路、大功率器件的理想散热和封装材料等
    ZrO2离子键萤石结构[22]强度和韧性高,导热性低,介电常数高[33]3C消费电子材料,牙科材料等
    Si3N4共价键六方晶系耐磨性和耐腐蚀性好,强韧性和导热率高[34-35]轴承,IGBT基板等
    下载: 导出CSV

    表  2  陶瓷材料的力学性能

    Table  2.   Mechanical properties of ceramic materials

    陶瓷硬度 H / GPa弹性模量 E / GPa断裂韧性 KIC / (MPa·m1/2)
    Al2O316.14223.9
    AlN9.83423.0
    Si3N414.72687.0
    ZrO213.52578.0
    下载: 导出CSV

    表  3  磨削实验参数

    Table  3.   Grinding parameters

    参数类型取值
    砂轮线速度vs / (m·s−1)10.47
    进给速度vw / (m·min−1)5.0,7.5,10.0,12.5
    磨削深度ap / μm5,10,15,20
    下载: 导出CSV
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  • 录用日期:  2022-03-14
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