Abstract: Slicing of monocrystalline silicon is an important process in integrated circuit industry and photovoltaic industry, where the slicing method and qualities directly affect the yield of sliced wafers and the cost of wafer substrate and photovoltaic solar cells. With the increase of wafer size, wire sawing technology has become the mainstream slicing technology of monocrystalline silicon. To realize high efficiency, precision and low crack damage slicing of monocrystalline silicon, this study presents two most commonly used slicing methods and their slicing characteristics, reviews the slicing mechanism and micro processing analysis of diamond wire sawing technology, summarizes the research on slicing induced crack damage and its suppression methods, and points out the development prospects and challenges of monocrystalline silicon slicing technology.