Cr元素对Ni基无硼钎料钎焊金刚石的组织及性能影响

王朋波; 石梦阳; 张雷; 纠永涛; 程战; 秦建; 丁梓超; 徐东

doi:10.13394/j.cnki.jgszz.2022.0056

Cr元素对Ni基无硼钎料钎焊金刚石的组织及性能影响

doi: 10.13394/j.cnki.jgszz.2022.0056

王朋波^{1, 2},
石梦阳¹,
张雷³,
纠永涛⁴,
程战³,
秦建⁴,
丁梓超¹,
徐东^{1, 2, ,}

1.
安徽工业大学材料科学与工程学院，安徽马鞍山 243002
2.
安徽工程大学材料科学与工程学院，安徽芜湖 241000
3.
中机智能装备研究院(宁波)有限公司，浙江宁波315700
4.
郑州机械研究所有限公司，新型钎焊材料与技术国家重点实验室，郑州 450001

基金项目: 新型钎焊材料与技术国家重点实验室开放课题（SKLABFMT-201803）；安徽省重点研究与开发计划（2022i01020008）

详细信息

通讯作者:
徐东，男，1973年生，教授、博士生导师。主要研究方向：异种材料连接技术，新型钎焊材料及钎焊技术。E-mail：frank@shu.edu.cn

中图分类号: TQ164; TG74; TG401
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- 被引次数: 0
出版历程
- 收稿日期: 2022-04-21
- 修回日期: 2022-06-07
- 录用日期: 2022-06-23
- 刊出日期: 2022-08-16

Effect of Cr on microstructure and properties of brazed diamond with Ni-based boron free solder

WANG Pengbo^{1, 2},
SHI Mengyang¹,
ZHANG Lei³,
JIU Yongtao⁴,
CHENG Zhan³,
QIN Jian⁴,
DING Zichao¹,
XU Dong^{1, 2
, ,}

1.
School of Materials Science and Engineering, Anhui University of Technology, Ma'anshan 243002, Anhui, China
2.
School of Materials Science and Engineering, Anhui Polytechnic University, Wuhu 241000, Anhui, China
3.
China Innovation Academy of Intelligent Equipment Co., Ltd., Ningbo 315700, Zhejiang, China
4.
State Key Laboratory of Advanced Brazing Filler Metals and Technology, Zhengzhou Research Institute of Mechanical Engineering Co., Ltd., Zhengzhou 450001, China

摘要

摘要: 针对B元素易使钎焊金刚石接头出现较多硬脆相的问题，制备一种新型Ni–Cr–Si–Cu–Sn无硼活性钎料，分析Cr元素对钎料组织和钎焊金刚石试样性能的影响规律。结果表明：Cr元素具有细化钎料晶粒和调控钎料中各元素分布的作用，可以提高钎料合金的显微硬度。当Cr元素质量分数过高时，会使钎料的熔点升高，钎料的润湿性能下降。综合来说，含有质量分数为15%的Cr的无硼钎料性能最佳，钎焊金刚石试样的磨削性能较优良，接头处出现多种形状的Cr₇C₃相，实现了钎料对金刚石的高强度连接。
- 钎焊 /
- 金刚石 /
- 新型Ni基无硼钎料 /
- 活性元素 /
- 力学性能
Abstract: In view of the problem that B element is easy to cause more hard and brittle phases in brazed diamond joints, a new type of Ni–Cr–Si–Cu–Sn boron free active solder was prepared, and the effects of Cr element on the microstructure of solder and the properties of brazed diamond were analyzed. The results show that Cr element can refine the solder grain and regulate the distribution of elements in the solder, which can improve the microhardness of the solder alloy. Excessive Cr addition will cause the melting point of the solder to increase and the wettability of the solder to decrease. In general, the boron free solder containing 15% Cr has the best performance, the grinding performance of brazed diamond is better, and Cr₇C₃ phases of various shapes appear at the joint, realizing the high-strength connection of the solder to the diamond.
- brazing /
- diamond /
- new Ni-based boron free solder /
- active element /
- mechanical property

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图 1 钎料铸锭宏观形貌

Figure 1. Macro morphology of solder alloy ingot

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图 2 各组分钎料合金的显微组织

Figure 2. Microstructure of each component solder alloy

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图 3 各钎料合金的晶粒大小

Figure 3. Grain size of each solder alloy

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图 4 钎料合金显微组织的各元素面扫描图

Figure 4. Element surface scanning diagram of microstructure of solder alloy

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图 5 各钎料的XRD图谱

Figure 5. XRD of solder

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图 6 不同Cr元素质量分数的钎料合金的显微硬度

Figure 6. Microhardness of solder alloy with different Cr element mass fraction

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图 7 不同钎料合金的DSC曲线

Figure 7. DSC curves of different solder alloys

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图 8 不同钎焊式样的摩擦结果

Figure 8. Friction results of different brazing patterns

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图 9 3号钎料钎焊金刚石形貌

Figure 9. Morphology of diamond brazed with No. 3 solder

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图 10 钎焊接头蚀刻后的金刚石形貌

Figure 10. Diamond morphology of brazed joint after etching

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图 11 钎焊接头刻蚀后的金刚石形貌

Figure 11. Diamond morphology of brazed joint after etching

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表 1 新型无硼钎料成分表

Table 1. Composition of new boron free solder

钎料编号	Cr 质量分数 ω_Cr / %	Sn质量分数 ω_Sn / %	Cu质量分数 ω_Cu / %	Si质量分数 ω_Si / %	Ni质量分数 ω_Ni / %
1号	5	5	20	5	余量
2号	10	5	20	5	余量
3号	15	5	20	5	余量
4号	20	5	20	5	余量
5号	25	5	20	5	余量

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