Experimental analysis on application performance of electroplated diamond wire saw

The unique test device with constant force feed is set up to evaluate the application performance of diamond wire saws, and the experiment of cutting single crystal silicon is carried out with two different electroplated diamond wire saws Ⅰ and Ⅱ. In the experiment, the surface roughness, kerf width and abrasive shedding rate are observed and measured with related instruments, and the sawing efficiency is calculated by recording machining time. The results show that the performance of diamond wire saw could be evaluated by the test device, quantitatively. It is also found that the sawing efficiency of wire saw Ⅰ is 13.6% higher than that of wire saw Ⅱ. In addition, the surface roughness of wafer sliced in feeding direction and movement direction by wire saw Ⅱ is 17.5% and 10.8% smaller than that of wafer sliced by wire saw Ⅰ. The kerf width of wire saw Ⅰ is 3.8% lower than that of wire saw Ⅱ. Finally, the service life of wire saw Ⅱ is longer than that of wire saw Ⅰ. The abrasive shedding rate of wire saw Ⅰ is 2.1 times that of wire saw Ⅱ.