[1] | CHEN Jiahu, GE Peiqi. Simulation study of cutting fluid flow field in kerf of fine diameter diamond wire saw[J]. Diamond & Abrasives Engineering, 2024, 44(6): 781-788. doi: 10.13394/j.cnki.jgszz.2023.0235 |
[2] | PANG Jiwei, LI Sheng, GUO Mingbo, WANG Zhaohui, XI Jianren, YANG Xiaotao. Drilling of C/SiC composite micro holes with electroplated diamond bits[J]. Diamond & Abrasives Engineering, 2023, 43(1): 90-95. doi: 10.13394/j.cnki.jgszz.2022.0026 |
[3] | CHEN Yongbiao, ZHANG Songhui, ZHANG Xiaohong, YUCHI Guangzhi, DUAN Jia, JIANG Ruyi, ZHOU Yingying. Study on mechanism and process of cutting silicon carbide ceramics with diamond wire saw[J]. Diamond & Abrasives Engineering, 2021, 41(3): 60-67. doi: 10.13394/j.cnki.jgszz.2021.3.0009 |
[4] | ZHAO Yukang, BI Wenbo, GE Peiqi. Multi-camera visual inspection of abrasives distribution density on electroplated diamond wire saw surface[J]. Diamond & Abrasives Engineering, 2021, 41(2): 64-68. doi: 10.13394/j.cnki.jgszz.2021.2.0011 |
[5] | XIE Qian, GE Peiqi, MENG Jianfeng, BI Wenbo, MA Xiaobin, ZHENG Chuxi, GONG Yang. Study on mechanical properties of nickel-plated layer and abrasive holding force of electroplated diamond wire saw[J]. Diamond & Abrasives Engineering, 2020, 40(1): 50-55. doi: 10.13394/j.cnki.jgszz.2020.1.0008 |
[6] | MU Longge, GAO Huiqiang, WANG Yongfeng, WANG Zhiqi, LI Henan, LEI Laigui, WU Wushan, XU Benchao. Effect of ultra-high sintering pressure on performance of low content and fine particle PCBN[J]. Diamond & Abrasives Engineering, 2019, 39(4): 9-13. doi: 10.13394/j.cnki.jgszz.2019.4.0002 |
[7] | GAO Hang, KONG Weimiao. Development of consolidated diamond wire saw cutting technology for brittle materials[J]. Diamond & Abrasives Engineering, 2019, 39(4): 97-102. doi: 10.13394/j.cnki.jgszz.2019.4.0017 |
[8] | ZHENG Chuxi, MA Xiaobin, XIE Qian, BI Wenbo, GE Peiqi, GONG Yang, LIU Tingquan. Experimental analysis on sawing performance ofsand-suspension-electroplated wire saw[J]. Diamond & Abrasives Engineering, 2019, 39(1): 76-79. doi: 10.13394/j.cnki.jgszz.2019.1.0014 |
[9] | PANG Jiwei, GAO Yufei, LI Sheng. Surface characteristics and wire wear of electroplated diamond wire saw slicing photovoltaic polycrystalline silicon[J]. Diamond & Abrasives Engineering, 2019, 39(5): 92-96. doi: 10.13394/j.cnki.jgszz.2019.5.0016 |
[10] | WANG Qihao, BI Wenbo, GE Peiqi. Developing equipment for electro-depositing diamond wire saw[J]. Diamond & Abrasives Engineering, 2018, 38(2): 61-65. doi: 10.13394/j.cnki.jgszz.2018.2.0013 |
[11] | MENG Xinxin, LIN Youxi, REN Zhiying. Surface quality of grinding optical glasses using eletroplated diamond wheel[J]. Diamond & Abrasives Engineering, 2017, 37(3): 91-95. doi: 10.13394/j.cnki.jgszz.2017.3.0018 |
[12] | ZHOU Bo, MAO Jianbo. Quality inspection method for diamond wire saw[J]. Diamond & Abrasives Engineering, 2017, 37(2): 73-77. doi: 10.13394/j.cnki.jgszz.2017.2.0016 |
[13] | YAN Xiaotong, ZUO Dunwen, SUN Yuli, LI Rui, XU Yang. Manufacturing process of diamond wire saw by composite-brush-plating method[J]. Diamond & Abrasives Engineering, 2017, 37(1): 13-18,24. doi: 10.13394/j.cnki.jgszz.2017.1.0003 |
[14] | LIU Wentao, ZHAO Huiying, LI Bin, ZHAO Lingyu, YU Hechun, FANG Hongjun. Prediction of subsurface damage of endless diamond wire sawing YAG crystal[J]. Diamond & Abrasives Engineering, 2017, 37(3): 55-61,68. doi: 10.13394/j.cnki.jgszz.2017.3.0011 |
[15] | ZHANG Liaoyuan, SU Junjin, LIU Xiaodong, GUAN Huiyu, LIU Wei. Study on mechanical properties of diamond wire saw under ultrasonic tension[J]. Diamond & Abrasives Engineering, 2017, 37(4): 38-43. doi: 10.13394/j.cnki.jgszz.2017.4.0008 |
[16] | HE Jingyuan, LI Zhengxin, HE Weichun, DAI Xiaonan. Effect of magnetic susceptibility of diamond micropowder on performance of plated diamond wire saw[J]. Diamond & Abrasives Engineering, 2017, 37(2): 62-64. doi: 10.13394/j.cnki.jgszz.2017.2.0013 |
[17] | DAI Xiaonan, HE Weichun, LI Zhengxin, HE Jingyuan. Preparation of rapid electroplating diamond wire saw[J]. Diamond & Abrasives Engineering, 2017, 37(3): 81-87. doi: 10.13394/j.cnki.jgszz.2017.3.0016 |
[18] | XIE Guizhi, DONG Jiong, SHANG Zhentao, MIAO Tianying, JIN Tan. Study on the wheel performance in high feed rate dry grinding rail material[J]. Diamond & Abrasives Engineering, 2016, 36(5): 64-68. doi: 10.13394/j.cnki.jgszz.2016.5.0013 |
[19] | ZHANG Ziyu, XIAO Bing, WANG Bo, WANG Pengfei. Tensile performance and fracture analysis of brazed diamond wire saw[J]. Diamond & Abrasives Engineering, 2016, 36(5): 55-59. doi: 10.13394/j.cnki.jgszz.2016.5.0011 |
[20] | GAO Wei, CENG Jun, LI Hongyu, WANG Dongxue. Effect of power output on morphology of electroplating diamond wire[J]. Diamond & Abrasives Engineering, 2016, 36(4): 54-57. doi: 10.13394/j.cnki.jgszz.2016.4.0011 |