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Volume 42 Issue 4
Aug.  2022
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Article Navigation >  Diamond & Abrasives Engineering  > 2022  >  42(4): 442-448
XUAN Chuang, WANG Chaochao, BAI Fuhou, ZHANG Fenglin. Vitrified bond diamond grinding wheel based on hollow corundum microspheres[J]. Diamond & Abrasives Engineering, 2022, 42(4): 442-448. doi: 10.13394/j.cnki.jgszz.2021.4001
Citation: XUAN Chuang, WANG Chaochao, BAI Fuhou, ZHANG Fenglin. Vitrified bond diamond grinding wheel based on hollow corundum microspheres[J]. Diamond & Abrasives Engineering, 2022, 42(4): 442-448. doi: 10.13394/j.cnki.jgszz.2021.4001
shu

Vitrified bond diamond grinding wheel based on hollow corundum microspheres

doi: 10.13394/j.cnki.jgszz.2021.4001

  • School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou 510006, China

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  • Received Date: 2022-01-16
  • Accepted Date: 2022-03-25
  • Rev Recd Date: 2022-03-24
    Abstract
  • The effect of the content and the size (0.2, 0.4, 0.6 mm) of the hollow corundum microspheres on the total porosity, the flexural strength, the hardness and the microstructure of vitrified bond was investigated. The ceramic bonded diamond grinding wheel with hollow alumina microspheres as pore forming agent was prepared, and the grinding performance of the grinding wheel on quartz glass was studied. The results show that with the increase of the content of hollow corundum microspheres, the porosity increases, and the flexural strength and the hardness decreases at the same time. With the same content of hollow corundum microspheres, addition the smaller size of microspheres could lead to the increase of the porosity and the decrease of flexural and hardness. The vitrified bond diamond wheel contained with hollow corundum microspheres can used to grind quartz glass, and the surface roughness can be reduced from 0.5113 μm to 0.0206 μm. Diamond wheel contained with hollow corundum microspheres can used to grind quartz glass, and the surface roughness can be reduced from 0.5113 μm to 0.0206 μm.

     

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