CN 41-1243/TG ISSN 1006-852X
Volume 42 Issue 4
Aug.  2022
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WANG Sen, DONG Hai, GU Yu, WANG Ming, WANG Jiawei. Research on grinding quality and removal mechanism of polycrystalline diamond tools[J]. Diamond &Abrasives Engineering, 2022, 42(4): 467-472. doi: 10.13394/j.cnki.jgszz.2021.3002
Citation: WANG Sen, DONG Hai, GU Yu, WANG Ming, WANG Jiawei. Research on grinding quality and removal mechanism of polycrystalline diamond tools[J]. Diamond &Abrasives Engineering, 2022, 42(4): 467-472. doi: 10.13394/j.cnki.jgszz.2021.3002

Research on grinding quality and removal mechanism of polycrystalline diamond tools

doi: 10.13394/j.cnki.jgszz.2021.3002
  • Received Date: 2021-12-29
  • Accepted Date: 2022-02-14
  • Rev Recd Date: 2022-02-14
  • Aiming at grinding quality of polycrystalline diamond (PCD) tools, the grinding experiment was carried out to optimize the process parameters with cutting edge radius, cutting edge defect and flank roughness as the indexes. The grinding removal mechanism of PCD was also studied. The results show that the worktable setting pressure has the most significant effect on cutting edge radius. The diamond grinding wheel has the most significant effect on cutting edge defect. The grinding wheel speed has the most significant effect on flank roughness. PCD tools with high grinding quality can be obtained by using 4/5 ceramic-based diamond grinding wheel, 1 000 r/min grinding wheel speed and 170 N worktable setting pressure. Under the experimental conditions, the main removal methods of PCD are sliding effect and micro cracking. Smaller cutting edge radius, cutting edge defect and smoother surface of PCD can be obtained by micro cracking under the 1 000 r/min grinding wheel speed and the 170 N worktable setting pressure.

     

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