[1] | WANG Youliang, GAO Xichun, ZHANG Wenjuan. Optimization of magnetic compound fluid polishing process parameters for PMMA workpieces based on grey relational analysis[J]. Diamond & Abrasives Engineering, 2025, 45(1): 134-142. doi: 10.13394/j.cnki.jgszz.2023.0282 |
[2] | XUE Mingpu, XIAO Wen, LI Zongtang, WANG Zhankui, SU Jianxiu. Preliminary investigation of dry tribochemical mechanical polishing of single crystal SiC substrates[J]. Diamond & Abrasives Engineering, 2024, 44(1): 101-108. doi: 10.13394/j.cnki.jgszz.2023.0052 |
[3] | LIU Jianqi, KANG Renke, TIAN Junchao, DONG Zhigang, BAO Yan. The influence of precision polishing parameters on surface roughness of resin-rich layer on antenna reflective surface[J]. Diamond & Abrasives Engineering, 2023, 43(2): 250-256. doi: 10.13394/j.cnki.jgszz.2022.0044 |
[4] | XIANG Xiongbiao, ZHANG Xinna, ZHOU Kangkang, XU Xianghong. Optimization of camshaft grinding parameters based on response surface method and NSGA2[J]. Diamond & Abrasives Engineering, 2023, 43(3): 348-354. doi: 10.13394/j.cnki.jgszz.2022.0141 |
[5] | WANG Zeyu, PENG Yanan, SU Jianxiu, CHEN Jiapeng. Design and optimization of ferric chloride and oxalic acid based slurry to chemically mechanically polish stainless steel[J]. Diamond & Abrasives Engineering, 2023, 43(4): 497-503. doi: 10.13394/j.cnki.jgszz.2022.0159 |
[6] | WANG Lei, WU Runze, NIU Lin, AN Zhibo, JIN Zhuji. Study on electrochemical mechanical polishing process of silicon carbide crystal[J]. Diamond & Abrasives Engineering, 2022, 42(4): 504-510. doi: 10.13394/j.cnki.jgszz.2022.0029 |
[7] | CHEN Guomei, DU Chunkuan, NI Zifeng, BIAN Da, WANG Hao, ZHANG Ping, ZHANG Xin. Effect of complexing agent on chemical-mechanical polishing effect of 316L stainless steel[J]. Diamond & Abrasives Engineering, 2022, 42(6): 753-759. doi: 10.13394/j.cnki.jgszz.2022.0047 |
[8] | JI Daohang, CHEN Yan, GUO Nan, LIANG Yuhong, JI Junjie, WANG Yongqing. Optimizing process parameters of ultrasonic vibration assisted grinding CFRP based on response surface method[J]. Diamond & Abrasives Engineering, 2022, 42(5): 585-594. doi: 10.13394/j.cnki.jgszz.2022.0019 |
[9] | BIAN Da, SONG Enmin, NI Zifeng, QIAN Shanhua, ZHAO Yongwu. Optimization of CMP processing parameters for Si based on response surface method[J]. Diamond & Abrasives Engineering, 2022, 42(6): 745-752. doi: 10.13394/j.cnki.jgszz.2022.0081 |
[10] | WANG Hao, CHEN Guomei, NI Zifeng, QIAN Shanhua, BIAN Da, ZHAO Yongwu. Effect of 1, 2, 4 -triazole and benzotriazole on chemical-mechanical polishing of 316L stainless steel[J]. Diamond & Abrasives Engineering, 2021, 41(1): 83-88. doi: 10.13394/j.cnki.jgszz.2021.1.0014 |
[11] | XU Jiahui, KANG Renke, DONG Zhigang, WANG Ziguang. Review on chemical mechanical polishing of silicon wafers[J]. Diamond & Abrasives Engineering, 2020, 40(4): 24-33. doi: 10.13394/j.cnki.jgszz.2020.4.0004 |
[12] | DENG Jiayun, PAN Jisheng, ZHANG Qixiang, GUO Xiaohui, YAN Qiusheng. Research progress in chemical mechanical polishing of single crystal SiC substrates[J]. Diamond & Abrasives Engineering, 2020, 40(1): 79-91. doi: 10.13394/j.cnki.jgszz.2020.1.0013 |
[13] | WAN Ce, JIN Zhuji, WU Di, LIU Zuotao, SI Likun. Chemical mechanical planarization of copper sheet with high radius-thickness ratio[J]. Diamond & Abrasives Engineering, 2018, 38(3): 81-85. doi: 10.13394/j.cnki.jgszz.2018.3.0016 |
[14] | LIU Zhenhui, CHEN Shaokun, PENG Yanan, LI Jiejing, SU Jianxiu. Compositions of slurry used in chemical-mechanically polishing 304 stainless steel[J]. Diamond & Abrasives Engineering, 2018, 38(2): 78-81,88. doi: 10.13394/j.cnki.jgszz.2018.2.0016 |
[15] | BAI Linshan, WANG Jinpu, CHU Xiangfeng. Mechanism and optimization of chemical-mechanically polishing ceramic glass substrate with CeO_2 slurry[J]. Diamond & Abrasives Engineering, 2017, 37(2): 1-5,10. doi: 10.13394/j.cnki.jgszz.2017.2.0001 |
[16] | TONG Haocheng, LI Jun, GUO Taiyu, MING Shun, ZHU Yongwei, ZUO Dunwen. Research on the relationship between acoustic emission signal and material removal rate during fixed abrasive lapping[J]. Diamond & Abrasives Engineering, 2017, 37(5): 19-23. doi: 10.13394/j.cnki.jgszz.2017.5.0003 |
[17] | WANG Jinpu, BAI Linshan, CHU Xiangfeng. Investigation on the chemical mechanical polishing of A-plane sapphire[J]. Diamond & Abrasives Engineering, 2016, 36(3): 43-49. doi: 10.13394/j.cnki.jgszz.2016.3.0009 |
[18] | QIN Hongquan, WANG Yongsheng, LI Qing, CHEN Jiapeng, LIU Zhenhui, SU Jianxiu. Polishing slurry of chemical mechanical polishing SUS304 ultrathin stainless steel sheet[J]. Diamond & Abrasives Engineering, 2016, 36(6): 25-28,34. doi: 10.13394/j.cnki.jgszz.2016.6.0006 |
[19] | CHEN Jiapeng, CHEN Shaokun, LI Qing, QIN Hongquan, SU Jianxiu. Study on chemical mechanical polishing of 304 stainless steel sheet based on alkaline polishing slurry[J]. Diamond & Abrasives Engineering, 2016, 36(2): 6-9,23. doi: 10.13394/j.cnki.jgszz.2016.2.0002 |
[20] | LI Qing, CHEN Shaokun, PENG Yanan, QIN Hongquan, FU Sufang, SU Jianxiu. Chemical mechanical polishing process parameters of 304 stainless steel[J]. Diamond & Abrasives Engineering, 2016, 36(5): 21-25. doi: 10.13394/j.cnki.jgszz.2016.5.0004 |