CN 41-1243/TG ISSN 1006-852X
Volume 42 Issue 1
Mar.  2022
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LIU Henan, QIN Biao, WANG Tingzhang, TIAN Jinchuan, CHEN Mingjun. Interference analysis and ultra-precision grinding technology of hemispherical resonator curved surface machining[J]. Diamond &Abrasives Engineering, 2022, 42(1): 10-17. doi: 10.13394/j.cnki.jgszz.2021.0099
Citation: LIU Henan, QIN Biao, WANG Tingzhang, TIAN Jinchuan, CHEN Mingjun. Interference analysis and ultra-precision grinding technology of hemispherical resonator curved surface machining[J]. Diamond &Abrasives Engineering, 2022, 42(1): 10-17. doi: 10.13394/j.cnki.jgszz.2021.0099

Interference analysis and ultra-precision grinding technology of hemispherical resonator curved surface machining

doi: 10.13394/j.cnki.jgszz.2021.0099
  • Received Date: 2022-01-11
  • Accepted Date: 2022-01-18
  • Rev Recd Date: 2022-01-26
  • Available Online: 2022-03-17
  • As the core device of the hemispherical resonator gyroscope (HRG), the processing accuracy and the surface quality of hemispherical resonator directly affect the working accuracy and the service life of HRG. To solve the problem of hemispherical resonator processing and improve the performance of HRG, the interference in the processing of hemispherical resonator is analyzed theoretically according to the structural characteristics of the hemispherical resonator. Then, the grinding trajectory is planned by using the characteristics of the grinding area distribution of the ball-end grinding wheel, and the optimal turning angle of the ball-end grinding wheel during different grinding processing sections of the hemispherical resonator is determined. Finally, grinding experiments of hemispherical resonator are conducted on the developed hemispherical resonator ultra-precision grinding machine tool. The surface roughness (Ra value) of hemispherical resonator is improved from 0.615 8 μm to 0.040 2 μm after ultra-precision grinding processing, while the profile accuracy (PV value) is improved from 4.590 4 μm to 0.339 0 μm. The surface roughness Ra of the hemispherical resonator is further improved to 0.003 2 μm after magnetorheological polishing. The research shows that the grinding process after trajectory planning can avoid the interference between the grinding wheel rod and the workpiece. High-quality hemispherical resonator component is produced by using the above grinding process.

     

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