CN 41-1243/TG ISSN 1006-852X
XIA Jiang, DING Wenfeng, QIU Bo, XU Jiuhua. 3D simulation study on the chip formation process in high speed and ultra-high speed grinding of nickel-based superalloy[J]. Diamond & Abrasives Engineering, 2020, 40(6): 58-69. doi: 10.13394/j.cnki.jgszz.2020.6.0011
Citation: XIA Jiang, DING Wenfeng, QIU Bo, XU Jiuhua. 3D simulation study on the chip formation process in high speed and ultra-high speed grinding of nickel-based superalloy[J]. Diamond & Abrasives Engineering, 2020, 40(6): 58-69. doi: 10.13394/j.cnki.jgszz.2020.6.0011

3D simulation study on the chip formation process in high speed and ultra-high speed grinding of nickel-based superalloy

doi: 10.13394/j.cnki.jgszz.2020.6.0011
More Information
  • Rev Recd Date: 2020-07-10
  • Available Online: 2022-04-06

Catalog

    通讯作者: 陈斌, bchen63@163.com
    • 1. 

      沈阳化工大学材料科学与工程学院 沈阳 110142

    1. 本站搜索
    2. 百度学术搜索
    3. 万方数据库搜索
    4. CNKI搜索

    Article Metrics

    Article views (586) PDF downloads(32) Cited by(15)
    Proportional views
    Related

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return