Influence of disc material and abrasive on lapping effect of sapphire wafer is analyzed based on actual machining.Lapping effect,product yield and lapping efficiency are compared when using cast iron disc(CID),ceramic compound disc(CCD),resin-copper disc(RCD)and polyurethane cloth(PUC)with B
4C or diamond slurry.The results show that surface quality of sapphire wafer lapped by PUC is best,
Ra0.058μm,and that the lapping efficiency of CCD is highest,0.305μm/min with product yield at 96.08%.In conclusion,PUC and diamond slurry are recommended when requiring higher surface quality,such as
Ra ≤ 0.06μm,while CCD with B
4C slurry is better if more emphasis is put on cost and efficiency(
Ra ≤ 0.08μm).