[1] | WANG Zexiao, YE Linzheng, ZHU Xijing, LIU Yao, CHUAI Shida, LV Boyang, WANG Dong. Analysis of flow field characteristics of silicon carbide CMP under ultrasonic action[J]. Diamond & Abrasives Engineering, 2025, 45(1): 102-112. doi: 10.13394/j.cnki.jgszz.2023.0273 |
[2] | Experimental Study on Grinding Silicon Carbide with Small Diameter Diamond Grinding Wheel[J]. Diamond & Abrasives Engineering. doi: 10.13394/j.cnki.jgszz.2024.0030 |
[3] | YANG Yufei, LI Xiang, HE Yan, LIU Ming, XU Zicheng, GAO Xingjun. Simulation and experimental study on micro-cutting silicon carbide crystal with single grain diamond[J]. Diamond & Abrasives Engineering, 2024, 44(4): 495-507. doi: 10.13394/j.cnki.jgszz.2023.0158 |
[4] | XU Dongqu, WANG Chengyong, DU Cezhi, DING Feng, HU Xiaoyue. Physical and chemical characterization of the surface and removal process of silicon carbide ceramics by femtosecond laser processing[J]. Diamond & Abrasives Engineering, 2024, 44(4): 508-517. doi: 10.13394/j.cnki.jgszz.2023.0088 |
[5] | GU Zhibin, WANG Haoxiang, SONG Xin, KANG Renke, GAO Shang. Composition design and optimization of electrochemical mechanical polishing slurry for single crystal SiC[J]. Diamond & Abrasives Engineering, 2024, 44(5): 675-684. doi: 10.13394/j.cnki.jgszz.2023.0246 |
[6] | WANG Liangwen, DONG Sijie, SI Liang, WANG Shuguang, XIE Guizhong, DU Wenliao, LI Ke, LU Haixia. Analysis of anvil centering accuracy of cubic press based on small displacement torsor theory[J]. Diamond & Abrasives Engineering, 2024, 44(6): 733-743. doi: 10.13394/j.cnki.jgszz.2023.0202 |
[7] | LIU Yisheng, HUANG Hui, WANG Lanqing, LIAO Xinjiang. Experimental study on normal force of cutting sapphire with multi-wire swing reciprocating wire saw[J]. Diamond & Abrasives Engineering, 2024, 44(2): 143-150. doi: 10.13394/j.cnki.jgszz.2023.0039 |
[8] | WANG Chao, GE Peiqi, He Jikai, WANG Xinhui. Influence of crystal anisotropy and process parameters on surface shape deviation of sapphire slicing[J]. Diamond & Abrasives Engineering, 2023, 43(5): 612-620. doi: 10.13394/j.cnki.jgszz.2022.0207 |
[9] | WANG Lei, WU Runze, NIU Lin, AN Zhibo, JIN Zhuji. Study on electrochemical mechanical polishing process of silicon carbide crystal[J]. Diamond & Abrasives Engineering, 2022, 42(4): 504-510. doi: 10.13394/j.cnki.jgszz.2022.0029 |
[10] | HAO Xiaoli, YUAN Zewei, WEN Quan, GUO Shengli. Process research on ultrasonic vibration assisted lapping of single crystal silicon carbide[J]. Diamond & Abrasives Engineering, 2022, 42(3): 268-274. doi: 10.13394/j.cnki.jgszz.2021.0208 |
[11] | TIAN Ke, GUO Huiru, WU Yongbo, LU Zhengkai. Magnetic compound fluid polishing of aspheric workpiece under rotating magnetic field[J]. Diamond & Abrasives Engineering, 2022, 42(4): 495-503. doi: 10.13394/j.cnki.jgszz.2021.0211 |
[12] | XU Yuchun, ZHU Jianhui, WANG Ningchang, SHI Chaoyu, ZHAO Yanjun, SHAO Junyong, XU Shuai. Analysis on the lapping uniformity of MPCVD polycrystalline diamond wafer[J]. Diamond & Abrasives Engineering, 2022, 42(6): 705-712. doi: 10.13394/j.cnki.jgszz.2022.0162 |
[13] | ZHANG Liang, GUO Xipeng, WANG Dingwen, XU Wen, LIU Jian, HUANG Shuai, YIN Shaohui. On-machine measurement and compensation machining for ultra-precision cutting of optical aspheric surface[J]. Diamond & Abrasives Engineering, 2022, 42(1): 18-22. doi: 10.13394/j.cnki.jgszz.2021.0106 |
[14] | XI Jianpu, LIU Tongshi, LI Yadong, LI Bin, ZHAO Zexiang. Study on mechanism of waviness in cross grinding large diameter aspherical mirror[J]. Diamond & Abrasives Engineering, 2020, 40(3): 91-97. doi: 10.13394/j.cnki.jgszz.2020.3.0015 |
[15] | ZENG Kai, CHEN Hongkun, SHEN Jianyun, WU Xian, LU Lang. NC machining of axisymmetric aspherical glass lens with diamond grinding head[J]. Diamond & Abrasives Engineering, 2019, 39(4): 103-109. doi: 10.13394/j.cnki.jgszz.2019.4.0018 |
[16] | YAN Shuai, LIN Bin, CHEN Jingyue. Surface residual stress measurement of silicon carbidebased on fast surface detection method[J]. Diamond & Abrasives Engineering, 2018, 38(6): 80-85. doi: 10.13394/j.cnki.jgszz.2018.6.0015 |
[17] | CHEN Bing, LUO Liang, JIAO Haowen, LI Shichun, DENG Zhaohui, ZHAO Qingliang. Wear analysis of arc-sharped wheel in aspheric grinding process[J]. Diamond & Abrasives Engineering, 2018, 38(5): 56-60. doi: 10.13394/j.cnki.jgszz.2018.5.0011 |
[18] | ZHOU Xuguang, YAN Qiusheng, KONG Lingye. Uniform wear of the wheel in grinding axisymmetric aspheric[J]. Diamond & Abrasives Engineering, 2017, 37(2): 36-40. doi: 10.13394/j.cnki.jgszz.2017.2.0008 |
[19] | CHEN Bing, HU Honglu, ZHONG Yixing, LI Shichun, DENG Chaohui, ZHAO Qingliang. Analysis and experimental research of grinding wheel errors in cross grinding aspheric surfaces[J]. Diamond & Abrasives Engineering, 2017, 37(5): 24-29,40. doi: 10.13394/j.cnki.jgszz.2017.5.0004 |
[20] | SUN Penghui, YAN Ning, LI Xuewen, ZHAO Mengyue, HAN Xin, LI Henan, ZHAO Xinghao. Effect of SiC size on dress ceramic diamond lapping disc[J]. Diamond & Abrasives Engineering, 2016, 36(3): 65-68. doi: 10.13394/j.cnki.jgszz.2016.3.0013 |