[1] | ZHANG Rui, ZHOU Shuaikang, ZHAO Huadong, ZHU Zhenwei, HE Honghui, LIU Chang. Force of dressing grinding wheels by diamond rollers with orderly arrangement grains[J]. Diamond & Abrasives Engineering, 2025, 45(1): 93-101. doi: 10.13394/j.cnki.jgszz.2024.0004 |
[3] | YU Guihua, ZHU Tao, CAI Ming, AN Zhixin, WANG Chengjing, LUO Shubao. Study on chip formation in grinding nickel-based single-crystal superalloy DD5[J]. Diamond & Abrasives Engineering, 2023, 43(6): 760-771. doi: 10.13394/j.cnki.jgszz.2022.0169 |
[4] | SHAO Mengbo, CHEN Bochuan, GAO Xiaoxing, YUAN Songmei. Grinding of TiC particle-reinforced steel-matrix composite GT35 with small diameter grinding rods[J]. Diamond & Abrasives Engineering, 2022, 42(3): 338-347. doi: 10.13394/j.cnki.jgszz.2021.3007 |
[5] | SUN Yongjie, ZHU Tao, CAI Ming, ZHANG Yuxuan, FAN Chenrui, AN Zhixin. Influence of grinding lubrication methods on surface integrity of nickel-based single crystal superalloy[J]. Diamond & Abrasives Engineering, 2022, 42(2): 201-207. doi: 10.13394/j.cnki.jgszz.2021.0114 |
[6] | ZHANG Kun, YIN Zhen, DAI Chenwei, MIAO Qing, CHENG Qihui. Undeformed chip thickness characteristics in grain-workpiece contact zone in ultrasonic vibration assisted grinding[J]. Diamond & Abrasives Engineering, 2022, 42(1): 88-96. doi: 10.13394/j.cnki.jgszz.2021.0109 |
[7] | TANG Chengzhi, LYU Yushan, LI Xingshan, JIANG Kunliang, QI Yongchao. Grinding structured grooved surface with grinding wheel wound by diamond wire saw[J]. Diamond & Abrasives Engineering, 2021, 41(3): 33-39. doi: 10.13394/j.cnki.jgszz.2021.3.0005 |
[8] | XI Jianpu, LIU Tongshi, LI Yadong, LI Bin, ZHAO Zexiang. Study on mechanism of waviness in cross grinding large diameter aspherical mirror[J]. Diamond & Abrasives Engineering, 2020, 40(3): 91-97. doi: 10.13394/j.cnki.jgszz.2020.3.0015 |
[9] | ZHANG Bingchang, LI Zhong. Experimental study on grinding propeller with diamond belt[J]. Diamond & Abrasives Engineering, 2020, 40(3): 21-24. doi: 10.13394/j.cnki.jgszz.2020.3.0003 |
[10] | CHEN Bing, LUO Liang, JIAO Haowen, LI Shichun, DENG Zhaohui, ZHAO Qingliang. Wear analysis of arc-sharped wheel in aspheric grinding process[J]. Diamond & Abrasives Engineering, 2018, 38(5): 56-60. doi: 10.13394/j.cnki.jgszz.2018.5.0011 |
[11] | BIAN Huaying, WANG Xuetao. A new type of grinding wheel manufacturing technology for rubber roller[J]. Diamond & Abrasives Engineering, 2017, 37(6): 57-61. doi: 10.13394/j.cnki.jgszz.2017.6.0011 |
[12] | ZHAO Danna, WANG Chengyong, ZHOU Shaobo, JIANG Wentao, MAO Xueli, ZHENG Lijuan. Review on dental ceramics grinding[J]. Diamond & Abrasives Engineering, 2017, 37(1): 34-42. doi: 10.13394/j.cnki.jgszz.2017.1.0007 |
[13] | QU Meina, JIN Tan, GUO Zongfu, LU Ange. Study on grinding KDP crystal with the vertical spindle face grinding machine[J]. Diamond & Abrasives Engineering, 2017, 37(6): 19-23,33. doi: 10.13394/j.cnki.jgszz.2017.6.0003 |
[14] | ZHOU Xuguang, YAN Qiusheng, KONG Lingye. Uniform wear of the wheel in grinding axisymmetric aspheric[J]. Diamond & Abrasives Engineering, 2017, 37(2): 36-40. doi: 10.13394/j.cnki.jgszz.2017.2.0008 |
[15] | CHEN Bing, HU Honglu, ZHONG Yixing, LI Shichun, DENG Chaohui, ZHAO Qingliang. Analysis and experimental research of grinding wheel errors in cross grinding aspheric surfaces[J]. Diamond & Abrasives Engineering, 2017, 37(5): 24-29,40. doi: 10.13394/j.cnki.jgszz.2017.5.0004 |
[16] | MAO Shujie, XU Jiuhua, ZHAO Zhengcai, FU Yucan. Numerical analysis on hydrodynamic pressure in grinding contact zone[J]. Diamond & Abrasives Engineering, 2017, 37(1): 19-24. doi: 10.13394/j.cnki.jgszz.2017.1.0004 |
[17] | SHANG Wei, WANG Wenjian, GUO Jun, LIU Qiyue. Simulation of single grain grinding in rail grinding based on SPH method[J]. Diamond & Abrasives Engineering, 2016, 36(3): 54-59,64. doi: 10.13394/j.cnki.jgszz.2016.3.0011 |
[18] | ZHANG Feihu, MA Zhaokai, LI Chen, RAO Xiaoshuang. Modeling and simulation of surface form accuracy for aspheric SiC mirror based on reciprocating grinding[J]. Diamond & Abrasives Engineering, 2016, 36(5): 46-49,54. doi: 10.13394/j.cnki.jgszz.2016.5.0009 |
[19] | XU Shance, CAO Zhihe, WANG Ziguang, ZHOU Ping. Research on stress and subsurface damage on silicon wafer machined by rotational grinding[J]. Diamond & Abrasives Engineering, 2016, 36(3): 23-27. doi: 10.13394/j.cnki.jgszz.2016.3.0005 |
[20] | CHEN Jiang, ZHANG Feihu. Research on sub-surface crack depth in surface grinding for optical glass K9 based on grinding speed[J]. Diamond & Abrasives Engineering, 2016, 36(4): 13-17. doi: 10.13394/j.cnki.jgszz.2016.4.0003 |