To improve the effect of chemical mechanical polishing(CMP),the influence of oxidant and pH value on the material removal rate(MRR)and surface roughness has been studied.The results show that different oxidants obtain maximum MRRs at different optimal pH values,namely 181nm/min for hydrogen peroxide at pH=9,177 nm/min for chromic oxide at pH=11,172 nm/min for sodium dichromate at pH=11,and 147 nm/min for sodium hypochlorite oxidant at pH=11.It is also shown that the type of oxidant,the content of oxidant and the pH value in CMP slurry have little influence on the surface roughness of stainless steel in CMP 304 stainless steel.Due to high MRR,hydrogen peroxide and chromic oxide can be used as oxidants of alkaline slurry for polishing 304 stainless steel.