SiCp/Al材料的超低温磨削工艺与表面完整性

郭维诚; 韩少杰; 何启超; 郭淼现

doi:10.13394/j.cnki.jgszz.2024.0129

SiCp/Al材料的超低温磨削工艺与表面完整性

doi: 10.13394/j.cnki.jgszz.2024.0129

1.
上海理工大学机械工程学院, 上海 200093
2.
上海航天设备制造总厂有限公司, 上海 200245

基金项目: 国家自然科学基金（52105470，52275452）；上海市自然科学基金（22ZR1442900）。

详细信息

作者简介:
郭维诚，男，1990年生，博士、副教授。主要研究方向：复合材料精密加工技术。E-mail：wcguo@usst.edu.cn

通讯作者:
郭淼现，1988年生，博士、副教授。主要研究方向：切削加工及振动控制。E-mail：guomx@usst.edu.cn

中图分类号: TG580
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- 被引次数: 0
出版历程
- 收稿日期: 2024-08-22
- 修回日期: 2024-10-09
- 刊出日期: 2025-08-20

Ultra-low temperature grinding process and surface integrity of SiCp/Al material

1.
College of Mechanical Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China
2.
Shanghai Aerospace Equipments Manufacturer Co., Ltd., Shanghai 200245, China

摘要

摘要: SiCp/Al作为一种典型的颗粒增强金属基复合材料，凭借其优异的综合性能在航空航天、精密电子等领域得到了广泛应用，但其物理特性与可加工性能仍有提升空间。针对20%体积分数的SiCp/Al复合材料进行液氮超低温与室温风冷磨削实验，对比2种冷却介质下工艺参数对其磨削力、表面损伤的影响，并分析其表面粗糙度、残余应力和显微硬度的变化规律。结果表明：SiCp/Al的超低温磨削力和表面完整性变化趋势与室温风冷磨削时的相近；超低温增加了铝基体的致密性与均匀性，提高了材料整体和界面结合强度，使其磨削力较室温风冷时的更大，且能有效抑制铝基体和SiC颗粒的磨削损伤，降低材料表面粗糙度，提高材料的残余压应力和硬度，从而综合提升材料表面质量。
- SiCp/Al /
- 超低温 /
- 磨削 /
- 材料损伤 /
- 表面完整性
Abstract: Objectives As a new-generation high-performance structural material, silicon carbide particle-reinforced aluminum matrix composites (SiCp/Al) exhibit outstanding specific strength, wear resistance, and thermal stability, making them highly valuable in aerospace precision components, electronic packaging substrates, and other advanced manufacturing fields. However, common machining-induced damage issues such as matrix smearing and particle fragmentation severely compromise surface integrity and service performance. This study focuses on 20% SiCp/Al composites, systematically investigating the effects of process parameters on grinding force evolution, surface damage mechanisms, and surface integrity by comparing liquid nitrogen ultra-low temperature and room temperature air-cooling grinding conditions. The aim is to reveal the regulatory mechanisms of ultra-low temperature environments on composite machining performance and provide theoretical guidance for precision process optimization. Methods Grinding experiments are conducted on 20% SiCp/Al composites using diamond grinding wheels under single-factor conditions. The ultra-low temperature grinding experiments are performed on a vertical machining center with internal liquid nitrogen jet cooling, while conventional room temperature air-cooling serves as the control group. Process parameters includes wheel speed 2.04 to 2.98 m/s, feed rate 50 to 200 mm/min, grinding depth 5 to 20 μm, and grinding width 6 mm. A dynamometer monitored normal and tangential grinding forces in real time. Surface roughness is measured via white light interferometry, residual stress measured via X-ray diffraction analysis, and microhardness measured via a microhardness tester. Surface and subsurface damage is characterized using scanning electron microscopy. Results (1) Under both cooling conditions, grinding forces decreases with increased wheel speed and increases linearly with feed rate and grinding depth. The ultra-low temperature environment significantly enhances material yield strength and interfacial bonding strength, resulting in average grinding forces 1.7 to 2.7 times higher than those under room temperature air-cooling conditions. While room temperature grinding forces shows minor variations with parameter changes, wheel speed and feed rate exerts substantial impacts in ultra-low temperature grinding. (2) Grinding-induced damage in SiCp/Al primarily manifests as matrix smearing/tearing and SiC particle fracture/pullout. Despite higher grinding forces under ultra-low temperature conditions, surface damage is consistently less severe than under room temperature cooling. In ultra-low temperature grinding, reduced thermal effects and increased material strength/hardness promotes localized stress concentration, leading to minor matrix smearing and particle fracture. In contrast, room temperature grinding induces extensive matrix tearing, particle pullout, and associated cracks/pits. (3) Ultra-low temperature grinding effectively suppresses matrix smearing, pits, and crack propagation, achieving surface roughness values 16% to 42% lower than those under room temperature air-cooling conditions. Higher grinding forces under ultra-low temperature conditions enhances plastic deformation strengthening, while liquid nitrogen cooling minimizes thermal softening effects. Consequently, ultra-low temperature grinding generates larger residual compressive stress magnitudes and higher surface microhardness compared to room temperature grinding. Conclusions The liquid nitrogen ultra-low temperature environment significantly improves the mechanical properties of the SiCp/Al matrix and interfaces through cryogenic strengthening. Although grinding forces increase, this approach effectively suppresses machining damage, substantially reduces surface roughness, and generates enhanced residual compressive stress fields and uniform hardened layers. The influence of process parameters on grinding forces and surface integrity follows similar trends under both cooling conditions. Optimal parameter combinations with higher wheel speeds and smaller depths of cut enable efficient, low-damage machining. The transition in damage mechanisms and improvements in surface integrity validate that ultra-low temperature environments optimize material removal processes through thermo-mechanical coupling suppression and mechanical property enhancement, offering a novel pathway for precision machining of particle-reinforced composites.
- SiCp/Al /
- ultra-low temperature /
- grinding /
- material damage /
- surface integrity

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图 1 SiCp/Al的表面形貌

Figure 1. Surface morphology of SiCp/Al

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图 2 内冷式金刚石砂轮及其设计图

Figure 2. Internally cooled diamond grinding wheel and its design drawing

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图 3 SiCp/Al超低温和室温风冷磨削实验与测试现场布局

Figure 3. Layout of experimental and testing sites for SiCp/Al ultra-low temperature and room temperature air-cooling grinding

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图 4 不同工艺参数与SiCp/Al磨削力的关系

Figure 4. Relationship between different process parameters and SiCp/Al grinding forces

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图 5 不同砂轮速度下超低温和室温风冷时的SiCp/Al表面形貌

Figure 5. SiCp/Al surface morphologies at ultra-low temperature and room temperature air-cooling under different grinding wheel speeds

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图 6 不同进给速度下超低温和室温风冷时的SiCp/Al表面形貌

Figure 6. SiCp/Al surface morphologies at ultra-low temperature and room temperature air-cooling at different feed speeds

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图 7 不同磨削深度下超低温和室温风冷时的SiCp/Al表面形貌

Figure 7. SiCp/Al surface morphologies under ultra-low temperature and room temperature air-cooling at different grinding depths

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图 8 同一磨削参数下SiCp/Al的表面形貌对比

Figure 8. Comparison of surface morphology of SiCp/Al with same grinding parameters

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图 9 不同工艺参数与SiCp/Al表面粗糙度的关系

Figure 9. Relationship between different process parameters and SiCp/Al surface roughness

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图 10 不同工艺参数与SiCp/Al表面残余应力的关系

Figure 10. Relationship between different process parameters and SiCp/Al surface residual stress

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图 11 不同工艺参数与SiCp/Al表面显微硬度的关系

Figure 11. Relationship between different process parameters and microhardness of SiCp/Al surface

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表 1 SiCp/Al复合材料的主要化学成分

Table 1. Main chemical compositions of SiCp/Al

成分	质量分数 ω / %
SiC	19.50
Mg	1.25
Si	0.22
Ti	< 0.03
Fe	0.08
Cu	3.36
Al	余量

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表 2 SiCp/Al复合材料的机械物理性能

Table 2. Mechanical and physical properties of SiCp/Al

参数	取值
抗拉强度 σ₁ / MPa	560
屈服强度 σ₂ / MPa	370
密度 ρ / (g·cm⁻³)	2.84
泊松比 ε	0.38
弹性模量 E / GPa	105
热导率 K / (W·m⁻¹·K⁻¹)	178
线膨胀系数 λ / K⁻¹	1.51 × 10⁻⁶

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