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第14届材料加工学术会议:CALL For REPORTS

发布日期: 2023-11-03 阅读次数:
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The 14th Conference on Materials Processing (Part of the 14th Asia-Pacific Conference on Materials Processing held in China)

第14届材料加工学术会议(第14届亚太材料加工学术会议国内部分)

 

APCMP2023

 

Jinan, China

16-18 December 2023

 

 



Jointly Organized by

Qilu University of Technology (Shandong Academy of Sciences), China

Yanshan University, China

Guangdong University of Technology, China

Chinese Society of Advanced Manufacturing Technology

Chinese Production Engineering Institute, CMES

 

Hosted by

Qilu University of Technology (Shandong Academy of Sciences), China

 

 

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Aims and Scope

APCMP2023 is aimed to provide an opportunity for researchers and industrial practitioners from around the world to interchange information on the latest development and applications in the science and technologies of materials processing. Specifically, this conference focuses on material subtractive and additive processes, material forming in the melt, near-melt or powder state, as well as other advanced processes including micro- and nano-fabrication for metals, ceramics, polymers, composites, semiconductors and biomaterials.

 

Areas of Interest

The conference will not accept papers and publish proceedings, but provide a forum for scientific oral and poster presentations about the latest development in, but not limited to, the following areas:

Material subtractive processes, including cutting, grinding, lapping, polishing, ECM, EDM, and other material removal processes.

Material additive processes, including 3D Printing/additive manufacturing, surface coating, thin film etc.

Materials joining processes, including mechanical joining, welding, adhesive bonding.

Material forming processes, including sheet metal forming, bulk forming, powder forming, and casting.

Computer-aided design, manufacturing, and engineering (CAD/CAM/CAE) related to materials processing.

Analytical and numerical methods related to materials processing.

Advanced materials (such as composites, polymers, Semiconductors, micro-electronic materials, and bio-materials) processing.

• Micro- and nano-fabrication science and technologies, including nano-structuring and nano-patterning.

 

Important Dates

Deadline for submitting academic report title and abstract: 30 November 2023

Notification of academic report acceptance: 1 December 2023

Final submission of revised academic report title and abstract (in word): 5 Dec. 2023

Payment of registration due: 1 December 2023

Onsite registration: 16 December 2023

Technical sessions: 17-18 December 2023


Academic Report Collection Form* (Deadline: 30 November 2023)

Name of speaker

Organization

Photo

Cell phone

E-mail

Biography 

About 300 words. In English or Chinese.

Title of report

In English or Chinese.

Abstract of report

About 500 words. In English or Chinese.

*Submission mailbox: Chen Hui(陈辉)APCMP2023@163.comPhone: 16653130806.

 

Registration

By 1 December 2023

From 2 December 2023

Full-registration

CNY 1800

CNY 2000

Student registration

CNY 1500

CNY 1700

1. A registration includes academic report review for one report, one electronic USB flash drive of report abstracts, banquet, lunches, morning and afternoon teas, and attending all technical sessions.

2. Each registration entitles the presentation of one report.

3. Banquet tickets for accompanying persons and technical visit can be purchased separately.

Conference Language

English will be the official conference language, but Chinese is also acceptable.

Hotel Accommodation

Hotels of different star ratings will be suggested for APCMP2023 participants.


Conference Committees

Conference Chairpersons:

    Chairman: Duan Peiyong, Qilu University of Technology (Shandong Academy of Sciences), China

    Co-Chairmen: WANG Jun, Guangdong University of Technology, China

            FUH Jerry, National University of Singapore, Singapore

            HUANG Chuanzhen, Yanshan University, China

            TAN Ming Jen, Nanyang Technological University, Singapore


International Scientific Committee:

    Chairman: LIU Zhanqiang, Shandong University, China

    Co-Chairman: YAO Jing, Yanshan University, China

            XU Chonghai, Qilu University of Technology, China

Members:

BABU N.R., Indian Institute of Technology-Madras, India

BAYRAKTAR Emin, Supmeca/LISMMA-Paris, France

BUTDEE Suthep, King Mongkut's University of Technology North Bangkok, Thailand

CAO Peng, The University of Auckland, New Zealand

CHEN Arthur, National Taiwan University of Science and Technology, Taiwan, China

CHEN Ming, Shanghai Jiao Tong University, China

CHEN Xun, Liverpool John Moores University, UK

DAI Yifan, National University of Defense Technology, China

FANG Fengzhou, Tianjin University, China

FUH Jerry, National University of Singapore, Singapore

GAN Yong, California State Polytechnic University, Pomona, USA

GAO Hang, Dalian University of Technology, China

GAO Wei, The University of Auckland, New Zealand

GAO Yongshegn, Hong Kong University of Science and Technology, HK, China

GONG Yadong, Northeastern University, China

HAMDI M., University of Malaya, Malaysia

HE Lin, Liupanshui Normal College, China

HE Ning, Nanjing University of Aeronautics and Astronautics, China

HUANG Han, University of Queensland, Australia

HUANG Chuanzhen, Yanshan University, China

JAWAHIR I.S., University of Kentucky, USA

JIANG Zhengyi, University of Wollongong, Australia

JOSHI S.S., Indian Institute of Technology-Bombay, India

KANG Renke, Dalian University of Technology, China

KURIYAGAWA T., Tohoku University, Japan

LEE K.S., National University of Singapore, Singapore

LI Changhe, Qingdao University of Technology, China

LI Lu, National University of Singapore, Singapore

LI Yanhui, Qingdao University, China

LIU Guijie, Ocean University of China

LIU Hanlian, Shandong University, China

LIU Xianli, Harbin University of Science and Technology, China

LIU Zhanqiang, Shandong University, China

MORGAN M.N., Liverpool John Moores University, UK

NARAYANSWAMY S., Concordia University, Canada

OBIKAWA T., University of Tokyo, Japan

PAN Jisheng, Guangdong University of Technology, China

PAUL Soumitra, Indian Institute of Technology-Kharagpur, India

RAHMAN M., National University of Singapore, Singapore

RONG Yiming, South University of Science and Technology, China

SAETANG, Viboon, King Mongkut’s Univ of Tech. Thonburi, Thailand.

TAN M.J., Nanyang Technological University, Singapore

TANG Yong, Shenzhen University, China

TSO P.L., National Tsing Hua University, Taiwan, China

VENKATAKRISHNAN K, Ryerson University, Canada

WANG Chengyong, Guangdong University of Technology, China

WANG Guobiao, Tianjin University, China

WANG Jun, Guangdong University of Technology, China

WANG Wei, China University of Petroleum (East China), China

WANG Xibin, Beijing University of Technology, China

WANG Yang, Harbin Institute of Technology, China

WU Yongbo, South China University of Science and Technology, China

XIA Wei, South China University of Technology, China

XIA Kenong, The University of Melbourne, Australia

XU Chonghai, Qilu University of Technology, China

XU Xipeng, Huaqiao University, China

YAN Jiwang, Keio University, Japan

YAN Qiusheng, Guangdong University of Technology, China

YANG Rui, Director of Institute of Metals Research, Chinese Academy of Sciences

YAO Peng, Shandong University, China

YAO Yingxue, Harbin Institute of Technology, China

YAUN Weizheng, Northwestern Polytechnic University, China

YOUNG H.T., National Taiwan University, Taiwan, China

YUAN Julong, Zhejiang University of Technology, China

YUAN Wei, South China University of Technology, China

ZHANG Feihu, Harbin Institute of Technology, China

ZHENG Lijuan, Guangdong University of Technology, China

ZHOU Libo, Ibaraki University, Japan

ZHU Hongtao, Shandong University, China

ZOU Bin, Shandong University, China


Organizing Committee:

Chairman: XU Chonghai, Qilu University of Technology, China

Co-Chairmen: Xiao Guangchun, Qilu University of Technology, China

YAO Peng, Shandong University, China

WANG Zhen, Yanshan University, China

YANG Yang, Guangdong University of Technology, China


Members: Chen Zhaoqiang, Qilu University of Technology, China

Xia Yuhai, Qilu University of Technology, China

Du Jin, Qilu University of Technology, China

Su Guosheng, Qilu University of Technology, China

Yi Mingdong, Qilu University of Technology, China


Conference Secretariat

Yi Mingdong                    15053103340@163.com

Chen Hui                       chenhui@qlu.edu.cn

Luo Ting                        luoting414@163.com

Yang Yuying                    yyyingneu@163.com

Meng Xianglong                 mengxl_jn@163.com

Faculty of Mechanical Engineering

Qilu University of Technology (Shandong Academy of Sciences)

3501 Daxue Road,  

Jinan 250353, Shandong, China

Tel: +86-531-85953626

 


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发布日期: 2023-11-03 阅读次数: