Li C, Li X, Wu Y, et al. Deformation mechanism and force modelling of the grinding of YAG single crystals[J]. International Journal of Machine Tools and Manufacture, 2019, 143: 23-37.

Li, C., Piao, Y., Meng, B., Hu, Y., Li, L., & Zhang, F. Phase transition and plastic deformation mechanisms induced by self-rotating grinding of GaN single crystals[J]. International Journal of Machine Tools and Manufacture, 2022, 172: 103827.

Li C, Piao Y, Zhang F, Zhang Y, Hu Y, & Wang Y. Understand anisotropy dependence of damage evolution and material removal during nanoscratch of MgF2 single crystals[J]. International Journal of Extreme Manufacturing, 2023, 5, 015101.

Li C, Wu Y, Li X, et al. Deformation characteristics and surface generation modelling of crack-free grinding of GGG single crystals[J]. Journal of Materials Processing Technology, 2020, 279(5): 116577.

Li C, Hu Y, Zhang F, Geng Y, Meng B. Molecular dynamics simulation of laser assisted grinding of GaN crystals[J]. International Journal of Mechanical Sciences, 2023, 239, 107856.

Li C, Piao Y, Meng B, et al. Anisotropy dependence of material removal and deformation mechanisms during nanoscratch of gallium nitride single crystals on (0001) plane[J]. Applied Surface Science, 2022, 578: 152028.

Y Zhang, Q Wang, C Li, et al. Characterization of surface and subsurface defects induced by abrasive machining of optical crystals using grazing incidence X-ray diffraction and molecular dynamics[J]. Journal of Advanced Research, 2022, 26, 51-61.

Li C, Piao Y, Hu Y, et al. Modelling and experimental investigation of temperature field during fly-cutting of KDP crystals[J]. International Journal of Mechanical Sciences, 2021, 210: 106751.

Li C, Zhang F, Meng B, et al. Research of material removal and deformation mechanism for single crystal GGG (Gd3Ga5O12) based on varied-depth nanoscratch testing[J]. Materials & Design, 2017, 125: 180-188.

Li C, Zhang F, Wu Y, et al. Influence of strain rate effect on material removal and deformation mechanism based on ductile nanoscratch tests of Lu2O3 single crystal[J]. Ceramics International, 2018, 44(17): 21486-21498.

Li C, Zhang Y, Zhou G, et al. Theoretical modelling of brittle-to-ductile transition load of KDP crystals on (001) plane during nanoindentation and nanoscratch tests[J]. Journal of Materials Research and Technology, 2020, 9(6): 14142-14157.

Li C, Li X, Huang S, et al. Ultra-precision grinding of Gd3Ga5O12 crystals with graphene oxide coolant: Material deformation mechanism and performance evaluation[J]. Journal of Manufacturing Processes, 2021, 61: 417-427.

Li C, Zhang F, Wang X, et al. Repeated nanoscratch and double nanoscratch tests of Lu2O3 transparent ceramics: Material removal and deformation mechanism, and theoretical model of penetration depth[J]. Journal of the European Ceramic Society, 2018, 38(2): 705-718.

Li C, Zhang F, Piao Y. Strain-rate dependence of surface/subsurface deformation mechanisms during nanoscratching tests of GGG single crystal[J]. Ceramics International, 2019, 45(12): 15015-15024.

Li C, Zhang Q, Zhang Y, et al. Nanoindentation and nanoscratch tests of YAG single crystals: an investigation into mechanical properties, surface formation characteristic, and theoretical model of edge-breaking size[J]. Ceramics International, 2020, 46(3): 3382-3393.

Zhang Y, Wu T, Li C*, et al. Numerical simulations of grinding force and surface morphology during precision grinding of leucite glass ceramics[J]. International Journal of Mechanical Sciences, 2022, 231: 107562.

Z Dong, Y Yan, G Peng, C Li*, Y Geng*. Effects of sandwiched film thickness and cutting tool water contact angle on the processing outcomes in nanoskiving of nanowires[J]. Materials & Design, 2023, 225: 111438.

J Wang, Y Yan, C Li*, Y Geng*. Material removal mechanism and subsurface characteristics of silicon 3D nanomilling[J]. International Journal of Mechanical Sciences, 2023, 242: 108020.

Li, C., Hu, Y., Huang, S., Meng, B., Piao, Y., & Zhang, F. Theoretical model of warping deformation during self-rotating grinding of YAG wafers[J]. Ceramics International, 2022, 48: 4637-4648.

Li C, Zhang F, Meng B, et al. Material removal mechanism and grinding force modelling of ultrasonic vibration assisted grinding for SiC ceramics[J]. Ceramics International, 2017, 43: 2981-2993.

李琛, 张飞虎, 张宣, 等. 硬脆单晶材料塑性域去除机理研究进展[J]. 机械工程学报, 2019, 55(3): 181-190.