Analysis on delay phenomenon of resin diamond wire when slicing silicon

To erase the delay phenomenon of resin diamond wire slicing silicon, a slicing model was established to study the deformability of single diamond in resin layer. The relationship between shift δ and the bending arc A was analyzed. Theoretical research indicates that there is a positive correlation between δ and A. Diamond wires were then made at the same condition but with resins of different hardness and the contrast tests were implemented. After slicing, the wires were observed by SEM. It is found that at the same slicing condition, diamond wire with softer resin deforms more, and thus with bigger bending arc and longer slicing time. In conclusion, resin with high strength will add the curing strength of resin layer and decrease the deformability, thus efficiently solving the slicing delay problem.