| Citation: | LIU Jianhe, ZHOU Mingyu. Numerical simulation of multiphysics coupling for magnetic fluid grinding of germanium wafer by rotating magnetic field[J]. Diamond & Abrasives Engineering, 2023, 43(3): 392-400. doi: 10.13394/j.cnki.jgszz.2022.0189
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In order to improve the surface quality of germanium wafer, the material removal behavior of germanium wafer under the action of solid-liquid two-phase flow was studied by means of rotating magnetic field magnetic fluid grinding and numerical simulation. Firstly, the grinding principle of magnetic fluid was introduced. Secondly, a simulation model was established. Starting from the process parameters of magnetic fluid grinding and combined with finite element analysis, the surface mechanical properties are taken as the breakthrough point. The effects of processing parameters such as different excitation gaps, magnetic pole rotation speeds, and particle phase volume fractions on the surface quality of the germanium wafer were analyzed. The optimal processing parameters were determined. Finally, the magnetic fluid grinding test was carried out. The results show that when the excitation gap is 5 mm, the magnetic pole rotation speed is 1000 r/min, and the volume fraction of the particle phase is 25%. After grinding for 60 minutes, the surface quality of germanium wafer was improved effectively, and the surface roughness Ra decreased from 500 nm to 47 nm, which realized the removal of small plastic materials on the surface of germanium wafer.
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