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Volume 43 Issue 4
Aug.  2023
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Article Navigation >  Diamond & Abrasives Engineering  > 2023  >  43(4): 497-503
WANG Zeyu, PENG Yanan, SU Jianxiu, CHEN Jiapeng. Design and optimization of ferric chloride and oxalic acid based slurry to chemically mechanically polish stainless steel[J]. Diamond & Abrasives Engineering, 2023, 43(4): 497-503. doi: 10.13394/j.cnki.jgszz.2022.0159
Citation: WANG Zeyu, PENG Yanan, SU Jianxiu, CHEN Jiapeng. Design and optimization of ferric chloride and oxalic acid based slurry to chemically mechanically polish stainless steel[J]. Diamond & Abrasives Engineering, 2023, 43(4): 497-503. doi: 10.13394/j.cnki.jgszz.2022.0159
shu

Design and optimization of ferric chloride and oxalic acid based slurry to chemically mechanically polish stainless steel

doi: 10.13394/j.cnki.jgszz.2022.0159
  • 1.

    Zhengzhou Professional Technical Institute of Electronic & Information, Zhengzhou 451450, China

  • 2.

    Jiangsu Key Laboratory of Precision and Micro-Manufacturing Technology, National Key Laboratory of Science and Technology on Helicopter Transmission, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China

  • 3.

    School of Mechanical and Electrical Engineering, Henan Institute of Science and Technology, Xinxiang 453003, Henan, China

  • 4.

    Research Center for Advanced Micro- / Nano- Fabrication Materials, Shanghai University of Engineering Science, Shanghai 201620, China

More Information
  • Received Date: 2022-09-20
  • Accepted Date: 2022-11-30
  • Rev Recd Date: 2022-11-20
    Abstract
  • To enhance the chemical mechanical polishing (CMP) efficiency of flexible display substrates, a polishing slurry based on ferric chloride and oxalic acid was proposed for polishing 304 stainless steel substrates. An orthogonal optimization test was designed to determine the significance order of the influence of abrasive size, abrasive content, oxalic acid content and ferric chloride content on the material removal rate (MRR) and surface roughness (surface arithmetical mean height of area, Sa). The aim was to investigate the effects of ferric chloride and oxalic acid on MRR. An optimized polishing slurry capable of achieving an MRR of over 560 nm/min and a Sa as low as 8 nm after 30 min was obtain. Compared with the conventional polishing slurry, whose MRR is 226.56 nm/min, the novel slurry has doubled its polishing efficiency or more.

     

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