Effect of abrasive mass fraction on grinding performance of diamond grindingwheel for grinding silicon wafer

The porous vitrified-bond ultrafine diamond grinding wheel was fabricated through a modified gel casting technique in this study. Meanwhile, the microstructure and grinding performance of porous vitrified-bond ultrafine diamond grinding wheels, were evaluated at six different abrasive fractions (27%, 30%, 33%, 36%, 39%, 42% in mass percentage, respectively). The abrasive fraction was found to play an important influence directly on the grinding current, wheel wear rate and hence affected the surface integrity of Si wafers. Results revealed that a smooth surface with roughness of 4.8 nm was achieved by using the grinding wheel with abrasive fraction of 39%.