Citation: | HAO Xiaoli, YUAN Zewei, WEN Quan, GUO Shengli. Process research on ultrasonic vibration assisted lapping of single crystal silicon carbide[J]. Diamond & Abrasives Engineering, 2022, 42(3): 268-274. doi: 10.13394/j.cnki.jgszz.2021.0208 |
[1] |
赵敏, 贺文智, 朱昊辰, 等. 碳化硅在能源领域的应用及展望 [J]. 上海节能,2017(10):578-582. doi: 10.13770/j.cnki.issn2095-705x.2017.10.004
ZHAO Min, HE Wenzhi, ZHU Haochen, et al. The application and prospect of silicon carbide in the energy field [J]. Shanghai Energy Conservation,2017(10):578-582. doi: 10.13770/j.cnki.issn2095-705x.2017.10.004
|
[2] |
刘宏勋, 徐海. 碳化硅电力电子器件及其在电力电子变压器中的应用 [J]. 科学技术与工程,2020,20(36):14777-14790. doi: 10.3969/j.issn.1671-1815.2020.36.002
LIU Hongxun, XU Hai. Silicon carbide power electronic devices and their applications in power electronic transformers [J]. Science Technology and Engineering,2020,20(36):14777-14790. doi: 10.3969/j.issn.1671-1815.2020.36.002
|
[3] |
HOROWITZ K, REMO T, REESE S. A manufacturing cost and supply chain analysis of SiC power electronics applicable to medium-voltage motor drives [M]. Golden, CO: Clean Energy Manufacturing Analysis Center, 2017.
|
[4] |
朱泓达. 半导体材料在电子科学技术中的应用 [J]. 黑龙江科学,2020,11(10):80-81. doi: 10.3969/j.issn.1674-8646.2020.10.036
ZHU Hongda. The application of semiconductor materials in electronic science and technology [J]. Heilongjiang Science,2020,11(10):80-81. doi: 10.3969/j.issn.1674-8646.2020.10.036
|
[5] |
SHE X, HUANG A Q, LUCIA O, et al. Review of silicon carbide power devices and their applications [J]. IEEE Transactions on Industrial Electronics,2017(10):1.
|
[6] |
AIDA H, DOI T, TAKEDA H, et al. Ultraprecision CMP for sapphire, GaN, and SiC for advanced optoelectronics materials [J]. Current Applied Physics,2012,12(9):S41-S46.
|
[7] |
翟文杰, 高博. 单晶SiC的化学机械抛光及其增效技术研究进展 [J]. 哈尔滨工业大学学报,2018,50(7):1-10. doi: 10.11918/j.issn.0367-6234.201803130
ZHAI Wenjie, GAO Bo. Research progress of chemical mechanical polishing of single crystal SiC and its synergistic technology [J]. Journal of Harbin Institute of Technology,2018,50(7):1-10. doi: 10.11918/j.issn.0367-6234.201803130
|
[8] |
麦玉冰, 谢欣荣. 第三代半导体材料碳化硅(SiC)研究进展 [J]. 广东化工,2021,48(9):151-152,155.
MAI Yubing, XIE Xinrong. The Research progress of the third generation semiconductor material silicon carbide (SiC) [J]. Guangdong Chemical Industry,2021,48(9):151-152,155.
|
[9] |
韩润龙. 第三代半导体材料SiC平坦化技术的研究现状 [J]. 技术应用与研究,2018(11):73-75.
HAN Runlong. Research status of the third-generation semiconductor material SiC planarization technology [J]. Technology Application and Research,2018(11):73-75.
|
[10] |
李伟. SiC晶片精密研磨工艺及其表面损伤研究 [D]. 广州: 广东工业大学, 2013.
LI Wei. Research on the precision grinding process and surface damage of SiC wafers [D]. Guangzhou: Guangdong University of Technology, 2013.
|
[11] |
LEE T, KIM H, LEE S, et al. Self-dressing effect using a fixed abrasive platen for single-sided lapping of sapphire substrate [J]. Journal of Mechanical Science and Technology,2017,31(12):5649-5655. doi: 10.1007/s12206-017-1105-1
|
[12] |
PARK K H, KIM K T, HONG Y H, et al. Study on effect of ultrasonic vibration in machining of alumina ceramic [J]. Key Engineering Materials,2012,516:311-316. doi: 10.4028/www.scientific.net/KEM.516.311
|
[13] |
赵明利, 赵波, 高国富. 超精密研抛及超声波研抛技术分析 [J]. 现代机械,2006(6):50-53. doi: 10.3969/j.issn.1002-6886.2006.06.021
ZHAO Mingli, ZHAO Bo, GAO Guofu. Ultra-precision polishing and ultrasonic polishing technology analysis [J]. Modern Machinery,2006(6):50-53. doi: 10.3969/j.issn.1002-6886.2006.06.021
|
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