Effect of dicing blade formulation on chipping and cracking of GaAs wafers

The effect law of dicing blade formulations on the chipping and cracking quality of GaAs wafers was studied by designing of experiment method, which is to cut wafers through blades with different formulations, and to test the crack size on the top, back or side faces.The results show that the abrasive grain size of the blade is closely related to the cutting quality of GaAs wafer.The finer the abrasive grain size, the smaller the size of the cracks on the top, back or side.The correlation of abrasive concentration or bond strength to GaAs wafer cutting quality is not significant.Therefore, the cutting quality could be enhanced by adopting smaller abrasive and adjusting abrasive concentration and bond strength.