CN 41-1243/TG ISSN 1006-852X
Volume 39 Issue 4
Aug.  2019
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GAO Hang, KONG Weimiao. Development of consolidated diamond wire saw cutting technology for brittle materials[J]. Diamond & Abrasives Engineering, 2019, 39(4): 97-102. doi: 10.13394/j.cnki.jgszz.2019.4.0017
Citation: GAO Hang, KONG Weimiao. Development of consolidated diamond wire saw cutting technology for brittle materials[J]. Diamond & Abrasives Engineering, 2019, 39(4): 97-102. doi: 10.13394/j.cnki.jgszz.2019.4.0017

Development of consolidated diamond wire saw cutting technology for brittle materials

doi: 10.13394/j.cnki.jgszz.2019.4.0017
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  • Rev Recd Date: 2019-07-19
  • Available Online: 2022-04-06
  • Brittle materials have important applications in optical components industry, semiconductor industry, photovoltaic industry, stone industry and other fields. By analyzing the common cutting methods of brittle materials, the cutting principle of consolidated diamond wire saw, the manufacturing technology of consolidated diamond wire saw and the processing methods of consolidated diamond wire saw machine tools, the effects of different processing methods on the cutting quality of brittle materials were studied. The results show that the one-way circular diamond wire saw machine tool works for ultra-long time with high speed. The wire saw speed is stable. It can realize precision and ultra-precision cutting of hard and brittle materials, which is the mainstream of future development. The circular diamond wire saw is an important part of the one-way circular diamond wire saw machine tool, and its processing and manufacturing technology is the difficulty for future development.

     

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      沈阳化工大学材料科学与工程学院 沈阳 110142

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