CN 41-1243/TG ISSN 1006-852X
Volume 36 Issue 6
Dec.  2016
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DAI Jiajia, CHEN Hui, GUO Dameng. Residual stress of polycrystalline diamond compact[J]. Diamond & Abrasives Engineering, 2016, 36(6): 57-62. doi: 10.13394/j.cnki.jgszz.2016.6.0012
Citation: DAI Jiajia, CHEN Hui, GUO Dameng. Residual stress of polycrystalline diamond compact[J]. Diamond & Abrasives Engineering, 2016, 36(6): 57-62. doi: 10.13394/j.cnki.jgszz.2016.6.0012

Residual stress of polycrystalline diamond compact

doi: 10.13394/j.cnki.jgszz.2016.6.0012
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  • Rev Recd Date: 2016-10-14
  • Available Online: 2022-07-27
  • Residual stress is widely spread in polycrystalline diamond compact(PDC) products,which leads to failure PDC. In this research,we studied the composition of residual stress and established an inspection method to analyze residual stress by using XRD. The distribution rule of the stress is also discussed. The influence of thickness of PCD layer,size of diamond particle,shape of interface and content of Co on PDC residual stress is studied to provide a reference for residual stress control. In conclusion,it is showed that:1) on the surface of diamond layer,the maximum appears in the centre and decreases along radial direction; 2) the stress near the interface between PCD layer and carbide matrix has significant influence on service character of PDC product.

     

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