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金刚石微粉含量对硅酸钠基导热胶粘接和导热性能的影响

黄雷波 夏学锋 杨雪峰 张鹏 栗正新 王来福 陈梁

黄雷波, 夏学锋, 杨雪峰, 张鹏, 栗正新, 王来福, 陈梁. 金刚石微粉含量对硅酸钠基导热胶粘接和导热性能的影响[J]. 金刚石与磨料磨具工程, 2023, 43(2): 210-217. doi: 10.13394/j.cnki.jgszz.2022.0085
引用本文: 黄雷波, 夏学锋, 杨雪峰, 张鹏, 栗正新, 王来福, 陈梁. 金刚石微粉含量对硅酸钠基导热胶粘接和导热性能的影响[J]. 金刚石与磨料磨具工程, 2023, 43(2): 210-217. doi: 10.13394/j.cnki.jgszz.2022.0085
HUANG Leibo, XIA Xuefeng, YANG Xuefeng, ZHANG Peng, LI Zhengxin, WANG Laifu, CHEN Liang. Effect of diamond powder content on bonding and thermal conductivity of sodium silicate based thermal conductive adhesive[J]. Diamond & Abrasives Engineering, 2023, 43(2): 210-217. doi: 10.13394/j.cnki.jgszz.2022.0085
Citation: HUANG Leibo, XIA Xuefeng, YANG Xuefeng, ZHANG Peng, LI Zhengxin, WANG Laifu, CHEN Liang. Effect of diamond powder content on bonding and thermal conductivity of sodium silicate based thermal conductive adhesive[J]. Diamond & Abrasives Engineering, 2023, 43(2): 210-217. doi: 10.13394/j.cnki.jgszz.2022.0085

金刚石微粉含量对硅酸钠基导热胶粘接和导热性能的影响

doi: 10.13394/j.cnki.jgszz.2022.0085
基金项目: 河南工业大学创新基金支持计划专项资助(2021ZKCJ06)
详细信息
    作者简介:

    黄雷波:

    通讯作者:

    栗正新,男,1964年生,教授,硕士生导师。主要研究方向:超硬材料、磨料磨具,包括金刚石功能材料、先进超硬和普通磨料磨具、计算机模拟仿真和磨削技术等。E-mail:zhengxin_li@163.com。

  • 中图分类号: TQ164;TQ436

Effect of diamond powder content on bonding and thermal conductivity of sodium silicate based thermal conductive adhesive

Funds: Supported by the Innovative Funds Plan of Henan University of Technology
  • 摘要: 为找到导热胶粘接和导热综合性能最佳时的金刚石微粉含量范围,以金刚石微粉含量为变量,研究其对导热胶性能的影响。用硅烷偶联剂对所用不同粒径的金刚石微粉表面进行改性,其中对粒径为60 μm的金刚石微粉先单独进行表面刻蚀处理以增大其比表面积,再将粒径分别为60、20和10 μm的金刚石微粉按质量比为6∶2∶1的配比做填料、水玻璃做基体,制备一种新型无机导热胶。结果表明:同时,导热胶的粘接性能先升高后降低,在金刚石质量分数为60%时粘接性能最佳,拉伸剪切强度为1.98 MPa;随着金刚石含量增加,导热胶的导热性能先升高后降低,当金刚石质量分数为50%时导热性能最佳,导热系数为6.32 W/(m·K)。因而当金刚石质量分数为50%~60%时,导热胶的粘接性能和导热性能最佳。

     

  • 图  1  3-巯丙基三甲氧基硅烷对金刚石微粉表面改性机理

    Figure  1.  Mechanism of surface modification of diamond powder by (3-Mercaptopropyl) trimethoxysilane

    图  2  金刚石微粉刻蚀前后表面形貌

    Figure  2.  Surface morphologies of diamond powder before and after etching

    图  3  硅烷偶联剂改性处理前后金刚石微粉表面形貌

    Figure  3.  Surface morphologies of diamond powder before and after modification with silane coupling agent

    图  4  不同金刚石微粉质量分数时的水玻璃基导热胶断面形貌

    Figure  4.  The section morphology of water glass based thermal conductive adhesive with different mass fraction of diamond powder

    图  5  金刚石微粉、氧化镁、水玻璃、水玻璃基金刚石导热胶的XRD图谱

    Figure  5.  XRD patterns of diamond powder, magnesium oxide, sodium silicate, diamond thermal conductive adhesive based on sodium silicate

    图  6  硅烷偶联剂改性处理前后金刚石微粉的红外光谱

    Figure  6.  FTIR of diamond powder before and after silane coupling agent modification

    图  7  硅烷偶联剂改性之后金刚石微粉的EDS

    Figure  7.  EDS of diamond powder modified by silane coupling agent

    图  8  不同金刚石微粉含量对水玻璃基导热胶拉伸剪切强度的影响

    Figure  8.  The effect of different diamond powder content on tensile shear strength of sodium silicate based thermal conductive adhesive

    图  9  不同金刚石微粉含量对水玻璃基导热胶导热系数的影响

    Figure  9.  Effect of different diamond powder content on thermal conductivity of sodium silicate based thermal conductive adhesive

  • [1] 黄烁. 金刚石增强聚合物基导热复合材料的制备及性能研究 [D]. 哈尔滨: 哈尔滨工业大学, 2020.

    HUANG Shuo. Preparation and properties of diamond-reinforced polymer based thermal conductivity composites [D]. Harbin: Harbin Institute of Technology, 2020.
    [2] 李扬林. LED封装用水玻璃基导热胶研究 [D]. 哈尔滨: 哈尔滨工业大学, 2011.

    LI Yanglin. Research on water-glass based thermal conductive adhesive for LED packaging [D]. Harbin: Harbin Institute of Technology, 2011.
    [3] 张晓辉, 徐传骧. 新型电力电子器件封装用导热胶粘剂的研究 [J]. 电力电子技术,1999(5):61-62.

    ZHANG Xiaohui, XU Chuanxiang. Research on new thermal adhesive for power electronic device packaging [J]. Power Electronics Technology,1999(5):61-62.
    [4] 熊雯雯. 高导热环氧树脂复合绝缘胶黏剂的制备与性能研究 [D]. 北京: 北京交通大学, 2020.

    XIONG Wenwen. Study on preparation and properties of epoxy resin composite insulation adhesive with high thermal conductivity [D]. Beijing: Beijing Jiaotong University, 2020.
    [5] 关云来. 含多粒径h-BN粉导热胶的制备与性能研究 [D]. 南京: 南京工业大学, 2017.

    GUAN Yunlai. Preparation and properties of h-BN powder thermal conductive adhesive containing multi-particle size [D]. Nanjing: Nanjing University of Technology, 2017.
    [6] GOJNY F H, WICHMANN M, FIEDLER B, et al. Evaluation and identification of electrical and thermal conduction mechanisms in carbon nanotube/epoxy composites [J]. Polymer: The International Journal for the Science and Technology of Polymers,2006,47(6):2036-2045.
    [7] NITHIKARNJANATHARN J, UEDA H, TANOUE S, et al. The rheological behavior and thermal conductivity of melt-compounded polycarbonate/vapor-grown carbon fiber composites [J]. Polymer Journal,2012,44(5):427-432. doi: 10.1038/pj.2011.149
    [8] KIM J, KIM Y D, NAM D G, et al. Thermal properties of epoxy composites with silicon carbide and/or graphite [J]. Journal of the Korean Physical Society,2016,68(4):551-556. doi: 10.3938/jkps.68.551
    [9] 林雪春, 徐志娟, 罗大为. LED封装用环氧树脂/金刚石导热胶的研制 [J]. 塑料科技,2015,43(3):59-62. doi: 10.15925/j.cnki.issn1005-3360.2015.03.008

    LIN Xuechun, XU Zhijuan, LUO Dawei. Preparation of epoxy resin/diamond thermal conductive adhesive for LED packaging [J]. Plastics Science and Technology,2015,43(3):59-62. doi: 10.15925/j.cnki.issn1005-3360.2015.03.008
    [10] GUO H, SHENG H, PENG X, et al. Preparation and mechanical properties of epoxy/diamond nanocomposites [J]. Polymer Composites,2014,35(11):2144-2149. doi: 10.1002/pc.22877
    [11] GHIM D, KIM J H. Fabrication of acrylic copolymer with aluminum nitride fillers and its physical and thermal properties [J]. The Korean Journal of Chemical Engineering,2017,34(1):245-248. doi: 10.1007/s11814-016-0235-y
    [12] 陈冰威, 杨雪峰, 朱振东, 等. 氧化铈刻蚀金刚石表面形貌表征 [J]. 粉末冶金技术,2022,40(4):318-324, 333. doi: 10.19591/j.cnki.cn11-1974/tf.2021090018

    CHEN Bingwei, YANG Xuefeng, ZHU Zhendong, et al. Surface morphology characterization of cerium oxide etched diamond [J]. Powder Metallurgy Technology,2022,40(4):318-324, 333. doi: 10.19591/j.cnki.cn11-1974/tf.2021090018
    [13] 湖南大学. 一种多孔泡沫金刚石的制备方法: CN201610040477.1 [P]. 2016-07-06.

    Hunan University. Preparation method of porous foam diamond : CN201610040477.1 [P]. 2016-07-06.
    [14] 高波. 金刚石微粉增强聚碳酸酯复合树脂的制备及力学性能研究 [D]. 北京: 北京理工大学, 2015.

    GAO Bo. Preparation and mechanical properties of polycarbonate composite resin reinforced with diamond micropowder [D]. Beijing: Beijing Institute of Technology, 2015.
    [15] 赵雨薇. 磷酸盐基无机导热胶的制备及性能研究 [D]. 哈尔滨: 哈尔滨工业大学, 2021.

    ZHAO Yuwei. Preparation and properties of phosphate-based inorganic thermal conductive adhesive [D]. Harbin: Harbin Institute of Technology, 2021.
    [16] 万隆, 时丹, 王俊沙, 等. 硅烷偶联剂对金刚石表面改性研究 [J]. 湖南大学学报(自然科学版),2013,40(4):71-74.

    WAN Long, SHI Dan, WANG Junsha, et al. Study on the surface modification of diamond by silane coupling agent [J]. Journal of Hunan University (Natural Science Edition),2013,40(4):71-74.
    [17] 吉晓莉, 郑彩华, 魏磊, 等. 氨基硅烷偶联剂表面改性SiC微粉的研究 [J]. 化学与生物工程,2008(1):21-23. doi: 10.3969/j.issn.1672-5425.2008.01.007

    JI Xiaoli, ZHENG Caihua, WEI Lei, et al. Study on surface modification of SiC micropowder by aminosilane coupling agent [J]. Chemical and Biological Engineering,2008(1):21-23. doi: 10.3969/j.issn.1672-5425.2008.01.007
    [18] 胡晓刚, 顾晓宇, 仝毅, 等. 改性纳米金刚石增强增韧医用口腔复合树脂的研究 [J]. 化工新型材料,2006,34(2):60-62,67. doi: 10.3969/j.issn.1006-3536.2006.02.019

    HU Xiaogang, GU Xiaoyu, TONG Yi, et al. Study on modified nano-diamond reinforced and toughened medical oral composite resin [J]. New Chemical Materials,2006,34(2):60-62,67. doi: 10.3969/j.issn.1006-3536.2006.02.019
    [19] 常明, 郧海丽, 李中秋, 等. 二甲基硅油 C-Si 伸缩振动模式红外光谱研究 [J]. 材料导报,2016,30(4):81-84, 89.

    CHANG Ming, YUN Haili, LI Zhongqiu, et al. Infrared spectroscopy study of silicone oil C-Si stretching vibration [J]. Materials Review,2016,30(4):81-84, 89.
    [20] 张萌. 改性环氧树脂基填充型导热胶的制备及性能研究 [D]. 石家庄: 河北科技大学, 2018

    ZHANG Meng. Preparation and Properties of modified epoxy resin filled thermal conductive adhesive [D]. Shijiazhuang: Hebei University of Science and Technology, 2018
    [21] 石金亨, 刘莉, 邱钦标. 聚氨酯胶黏剂与镀锌板粘接强度的影响因素探讨 [J]. 广州化工, 2022, 50(4): 67-69.

    SHI Jinheng, LIU Li, QIU Qinbiao. Discussion on the influencing factors of the bond strengthbetween polyurethane adhesive and galvanized sheet [J]. Guangzhou Chemical Industry, 2022, 50(4): 67-69.
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出版历程
  • 收稿日期:  2022-06-07
  • 修回日期:  2022-09-20
  • 录用日期:  2022-09-22
  • 刊出日期:  2023-04-20

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