Research on preparation of vitrified bond lapping plates and lapping sapphire performance
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摘要: 为提高蓝宝石基片的研磨效率和质量,研制2种不同硬度的陶瓷结合剂固结金刚石研磨丸片并制作了相应的研磨盘,对蓝宝石基片进行研磨工艺试验以评估其研磨性能。结果表明:研磨时间延长,蓝宝石的材料去除率(RMRR)和表面粗糙度(Ra)均逐渐降低最后趋于稳定;研磨盘转速提高,2种研磨盘获得的工件材料去除率均先升高后降低,在研磨盘转速为60 r/min时达到最高,分别为1.81 μm/min和1.27 μm/min,但工件表面粗糙度则持续降低;研磨压力增大,2种研磨盘获得的工件材料去除率持续升高,在研磨压力为34.5 kPa时达到最高,分别为2.03 μm/min和1.49 μm/min,且此时的蓝宝石基片表面粗糙度最低分别为0.165 μm和0.141 μm。对比2种硬度的研磨盘磨损性能可以发现,研磨盘的硬度越高,其材料去除效率越高,研磨盘磨耗比越高,但研磨后的工件表面粗糙度相对较高。Abstract: To improve the lapping efficiency and processing quality of the sapphire substrate, two lapping plates composed of vitrified bond diamond lapping pellets with different hardness were developed, and the lapping process experiment was carried out on the sapphire substrate to evaluate its lapping performance. The results showed that as the processing time increases, the material removal rate (RMRR) and surface roughness (Ra) of two lapping plates both gradually decreased and finally stabilized. With the increase of the rotation of the plate speed, the material removal rate of the two plates first increased and then decreased, when the rotation speed of the plate was 60 r/min, the maximum material removal rates were 1.81 μm/min and 1.27 μm/min, respectively, but the surface roughness continued to decrease. As the lapping pressure increased, the material removal rate of the two plates continued to increase, when the lapping pressure was 34.5 kPa, the maximum of material removal rate reached 2.03 μm/min and 1.49 μm/min, respectively, the minimum of surface roughness were 0.165 μm and 0.141 μm, respectively. Comparing the wear performance of the two lapping plates with different hardnesses, it can be found that the higher the hardness of the lapping plate, the higher the material removal efficiency and the higher the grinding loss ratio of the plate, but the surface roughness of the workpiece was higher.
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