随机网格结构固结磨料磨盘平面磨削性能研究

石兴泰; 郭磊; 刘晓辉; 靳淇超; 陈瑱贤; 吕景祥; 王家庆

doi:10.13394/j.cnki.jgszz.2021.0210

随机网格结构固结磨料磨盘平面磨削性能研究

doi: 10.13394/j.cnki.jgszz.2021.0210

1.
长安大学，道路施工技术与装备教育部重点实验室，西安 710064
2.
重庆大学，机械传动国家重点实验室，重庆 400044

基金项目: 国家自然科学基金（51805044）；中国博士后科学基金（2020M673318）；重庆大学机械传动国家重点实验室开放课题（SKLMT-MSKFKT-202006）。

详细信息

作者简介:
通信作者：郭磊，男，1986年生，博士、副教授、硕士生导师。主要研究方向：智能与先进制造技术。E-mail：lguo@chd.edu.cn

中图分类号: TG74
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- PDF下载量: 43
- 被引次数: 0
出版历程
- 收稿日期: 2021-12-03
- 修回日期: 2022-03-11
- 录用日期: 2022-03-14
- 网络出版日期: 2022-07-13
- 刊出日期: 2022-07-13

Study on machining performance of fixed-abrasive lap-grinding plate with random grid structure

1.
Key Laboratory of Road Construction Technology and Equipment, Ministry of Education, Chang’an University, Xi’an 710064, China
2.
State Key Laboratory of Mechanical Transmission, Chongqing University, Chongqing 400044, China

摘要

摘要: 针对超精密磨削加工过程对工件材料去除效率、表面质量、亚表面损伤等指标的复合需求，提出一种基于泰勒多边形设计的随机网格结构固结磨料磨盘（textured-fixed abrasive plate, T-FAP），并以光固化树脂作为结合剂基体材料混合微米级氧化铝磨料制备磨盘，使用MATLAB图像分析和磨抛轨迹仿真方法研究磨盘磨削过程中表面磨损时变图案特征对其加工性能的影响，并通过铝制工件的平面磨削实验对磨盘磨削过程中的材料去除率及工件表面粗糙度进行分析。实验结果表明：相比传统固结磨料磨盘，采用随机网格结构磨盘加工的工件表面粗糙度为0.84 μm，材料去除率为3.21 μm/min，能够在保证材料去除率的同时获得较高的表面精度。
- 固结磨料磨具 /
- 平面磨削 /
- 表面粗糙度 /
- 材料去除率
Abstract: To meet the increasing requirements on material removal efficiency, surface quality, and subsurface damage in the ultra-precision grinding process, a textured-fixed abrasive plate (T-FAP) with random grid structure based on the Voronoi Diagram is proposed. The abrasive tool is fabricated by using UV-curable resin and micro-level alumina abrasive grains. The influence of time-varying texture characteristics of surface wear on the machining performance is studied via MATLAB image analysis and numerical simulation of the grinding trajectory. The lap-grinding experiment of the aluminum workpieces is carried out to analyze the material removal efficiency and workpiece surface roughness obtained from the T-FAP grinding process. The results show that the surface roughness of the workpiece processed with the T-FAP grinding is 0.84 μm, and that the material removal rate is 3.21 μm/min. Compared with the traditional fixed abrasive grinding tool, the T-FAP grinding ensures the material removal efficiency and obtains high surface accuracy as well.
- fixed-abrasive tool /
- lap-grinding /
- surface roughness /
- material removal rate

HTML全文

图 1 自然界中的泰森多边形

Figure 1. Tyson polygons in nature

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图 2 3D Max中的磨盘建模流程

Figure 2. Modeling process in 3D Max

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图 3 随机网格结构磨盘3D Max模型

Figure 3. 3D Max model of the T-FAP

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图 4 不同磨料浓度的树脂基体固化试样

Figure 4. Cured samples of resin matrix with different abrasive concentrations

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图 5 随机网格结构平面磨盘

Figure 5. Fixed-abrasive lap-grinding plate with random grid structure

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图 6 平面磨削加工过程示意图

Figure 6. Schematic diagram of lap-grinding process

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图 7 平面磨削加工过程轨迹分析

Figure 7. Trajectory analysis of the lap-grinding process

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图 8 不同表面图案特征的T-FAP

Figure 8. T-FAP in different surface patterns

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图 9 T-FAP 05磨盘逐层截面磨粒轨迹面积比

Figure 9. Area ratio by abrasive grain trajectory in different layer of T-FAP 05

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图 10 T-FAP 05逐层截面图案特征叠加

Figure 10. Stacking of T-FAP 05 surface pattern images

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图 11 双面研磨机

Figure 11. Double side lap-grinding machine

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图 12 磨盘和工件

Figure 12. Lap-grinding plate and workpieces

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图 13 表面粗糙度测量设备

Figure 13. Surface roughness measuring set-up

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图 14 不同转速下表面粗糙度与材料去除率

Figure 14. Surface roughness and material removal rate at different rotating speeds

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图 15 不同磨削液浓度下表面粗糙度与材料去除率

Figure 15. Surface roughness and material removal rate with different abrasive concentrations

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图 16 不同磨削压力下表面粗糙度与材料去除率

Figure 16. Surface roughness and material removal rate under different grinding pressures

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图 17 不同磨料面积比下表面粗糙度与材料去除率

Figure 17. Surface roughness and material removal rate with different abrasive area ratios

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图 18 磨削前后工件表面对比图

Figure 18. Comparison of workpiece surface before and after grinding

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表 1 3D Max中磨盘建模参数

Table 1. Modeling parameters of the lap-grinding plate in 3D Max

参数	数值
半径1 r₁ / mm	130
半径2 r₂ / mm	60
高度 h / mm	10
随机点数量 n	8 000
随机种子数量 n₀	10
壳内部量 n_in	0
壳外部量 n_out	1
网格平滑度 f	1

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表 2 LCD光固化打印机与树脂材料参数

Table 2. LCD Light-curing 3D printer and resin material characteristics

参数	数值或类型
打印层厚度 d / mm	0.01~0.20
打印速度 v / (mm·h⁻¹)	20
额定功率 P / W	50
固化光源	LCD紫外光
材料固化密度 ρ / (g·cm⁻³)	1.05～1.25
材料固化波长 λ / nm	355～410
材料固化硬度 H	80 D
材料固化收缩率 β / %	3.72～4.24

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表 3 不同磨盘磨粒轨迹所形成的面积占比

Table 3. Area ratio by abrasive grain trajectory of different lap-grinding plates

名称	轨迹面积比 S / %
T-FAP 01	33.702
T-FAP 02	36.003
T-FAP 03	30.735
T-FAP 04	43.293

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表 4 磨削实验参数表

Table 4. Parameters of lap-grinding experiment

因素	水平
因素	Ⅰ	Ⅱ	Ⅲ
电机转速 n / (r·min⁻¹)	300	600	900
磨削液浓度 c / %	0.9	1.2	1.5
磨削压力 F / N	78	81	84
磨盘有效面积比 α / %	72	54	63

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参考文献(11)

[1]	TAWAKOLI T, AZARHOUSHANG B. Influence of ultrasonic vibrations on dry grinding of soft steel [J]. International Journal of Machine Tools & Manufacture: Design, Research and Application,2008,48(14):1585-1591.
[2]	HASHIMOTO F, SILVA E J, GUO C, et al. Industrial challenges in grinding [J]. CIRP Annals-Manufacturing Technology,2009,58(2):663-680. doi: 10.1016/j.cirp.2009.09.006
[3]	BRINKSMEIER E, MUTLUGUNES Y, KLOCKE F, et al. Ultra-precision grinding [J]. CIRP Annals-Manufacturing Technology,2010,59(2):652-671. doi: 10.1016/j.cirp.2010.05.001
[4]	TAWAKOLI T, AZARHOUSHANG B. Intermittent grinding of ceramic matrix composites (CMCs) utilizing a developed segmented wheel [J]. International Journal of Machine Tools & Manufacture,2011,51(2):112-119. doi: 10.1016/j.ijmachtools.2010.11.002
[5]	LEE K W, WONG P K, ZHANG J H. Study on the grinding of advanced ceramics with slotted diamond wheels [J]. Journal of Materials Processing Technology,2000,100(1):230-235.
[6]	杨张一. 开槽冰冻固结磨料抛光垫的抛光性能研究 [D]. 南京: 南京航空航天大学, 2013. YANG Zhangyi. Study on polishing performance of ice fixed abrasive polishing pad with grooves [D]. Nanjing: Nanjing University of Aeronautics and Astronautics, 2013.
[7]	TSAI M Y, WANG S M, TSAI C C, et al. Investigation of increased removal rate during polishing of single-crystal silicon carbide [J]. International Journal of Advanced Manufacturing Technology,2015,80(9/10/11/12):1511-1520. doi: 10.1007/s00170-015-7023-4
[8]	FANG C F, ZHAO Z X, LU L Y, et al. Influence of fixed abrasive configuration on the polishing process of silicon wafers [J]. International Journal of Advanced Manufacturing Technology,2017,88(1/2/3/4):575-584. doi: 10.1007/s00170-016-8808-9
[9]	FANG C F, ZHAO Z X, HU Z W. Pattern optimization for phyllotactic fixed abrasive pads based on the trajectory method [J]. IEEE Transactions on Semiconductor Manufacturing,2017,30(1):78-85. doi: 10.1109/TSM.2016.2637058
[10]	FANG C F, YAN Z, HU Z W, et al. Pattern design of fixed abrasive pads inspired by the bee colony theory [J]. International Journal of Advanced Manufacturing Technology,2018,97(5/6/7/8):2563-2574. doi: 10.1007/s00170-018-2114-7
[11]	林魁. 固结磨料研磨抛光垫的性能评价及自修整机理的研究 [D]. 南京: 南京航空航天大学, 2010. LIN Kui. Performance evaluation and self-conditioning of fixed-abrasive pad [D]. Nanjing: Nanjing University of Aeronautics and Astronautics, 2010.