Abstract: The effects of different resin binders on the cutting performances of diamond wire were studied. Resin hardness samples were prepared with pure phenolic resin, epoxy modified phenolic resin and aryl modified phenolic resin respectively, and Shaw hardness of the samples was tested. Fracture surface of resin cured samples were observed by scanning electron microscopy. It was found that the densification of different resin cured sample was different. The resin diamond wires were made with these resins, and the monocrystalline silicon cutting experiment was carried out. The experimental results show that the diamond wire made of pure phenolic resin with high hardness and good compactness after curing has the smallest arch and shorter cutting time, and that the diamond particles are not easy to fall off thus possessing a strong cutting ability.