Abstract: Rotational grinding is widely used in grinding hard brittle material such as silicon, glass and ceramics. The prediction of grinding surface topography is important for mechanism research and process optimization. Based on analyses and experiment validations of current models, the problems of these models are analyzed and the promotions put forward:When simulating ultra-precision grinding, it is necessary to modify the amount of effective grains; The recovery of workpiece, the cutting edge radius of grains and the critical cutting depth of chip formation are factors that need further attention. The result could promote acknowledge of grinding mechanism and process, and thus promoting the efficiency of rotational grinding.