Study on chemical mechanical polishing of 304 stainless steel sheet based on alkaline polishing slurry
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摘要: 为提高化学机械抛光的加工效果,我们研究了pH值、氧化剂种类和氧化剂含量对材料去除率和表面粗糙度的影响。结果表明:不同氧化剂的抛光液在各自的最佳pH值时达到最大的材料去除率,分别为181 nm/min(H2O2抛光液,pH=9),177 nm/min(Cr2O3抛光液,pH=11),172 nm/min(Na2Cr2O7抛光液,pH=11)和147 nm/min(NaClO抛光液,pH=13);抛光液中氧化剂含量、pH值对抛光后不锈钢的表面粗糙度影响较小。其中,材料去除率较高的H2O2和Cr2O3可作为304不锈钢化学机械抛光碱性抛光液的氧化剂。Abstract: To improve the effect of chemical mechanical polishing(CMP),the influence of oxidant and pH value on the material removal rate(MRR)and surface roughness has been studied.The results show that different oxidants obtain maximum MRRs at different optimal pH values,namely 181nm/min for hydrogen peroxide at pH=9,177 nm/min for chromic oxide at pH=11,172 nm/min for sodium dichromate at pH=11,and 147 nm/min for sodium hypochlorite oxidant at pH=11.It is also shown that the type of oxidant,the content of oxidant and the pH value in CMP slurry have little influence on the surface roughness of stainless steel in CMP 304 stainless steel.Due to high MRR,hydrogen peroxide and chromic oxide can be used as oxidants of alkaline slurry for polishing 304 stainless steel.
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Key words:
- 304stainless steel /
- alkaline slurry /
- pH value /
- oxidant /
- chemical mechanical polishing /
- material removal rate
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