Citation: | HUANG Leibo, XIA Xuefeng, YANG Xuefeng, ZHANG Peng, LI Zhengxin, WANG Laifu, CHEN Liang. Effect of diamond powder content on bonding and thermal conductivity of sodium silicate based thermal conductive adhesive[J]. Diamond & Abrasives Engineering, 2023, 43(2): 210-217. doi: 10.13394/j.cnki.jgszz.2022.0085 |
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