脆性材料磨粒加工的纳米尺度去除机理

黄水泉; 高尚; 黄传真; 黄含

doi:10.13394/j.cnki.jgszz.2021.3009

脆性材料磨粒加工的纳米尺度去除机理

doi: 10.13394/j.cnki.jgszz.2021.3009

黄水泉^{1, 2,},
高尚³,
黄传真¹,
黄含²

1.
燕山大学机械工程学院，河北秦皇岛 066004
2.
昆士兰大学机械与矿业工程学院，澳大利亚昆士兰 4072
3.
大连理工大学, 精密与特种加工教育部重点实验室，辽宁大连 116024

基金项目: 澳大利亚研究理事会探索研发项目（DP210102061）；中国国家自然科学基金（51975091）；河北省自然科学基金（E2022203123）。

详细信息

作者简介:
黄含，男，1964年生，教授。主要研究方向：先进制造技术和纳米力学表征。 E-mail: han.huang@uq.edu.au

中图分类号: TG73
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- 文章访问数: 2005
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- 被引次数: 0
出版历程
- 收稿日期: 2022-04-23
- 修回日期: 2022-05-14
- 录用日期: 2022-05-20
- 网络出版日期: 2022-07-13
- 刊出日期: 2022-07-13

Nanoscale removal mechanisms in abrasive machining of brittle solids

1.
School of Mechanical Engineering, Yanshan University, Qinhuangdao 066004, Hebei, China
2.
School of Mechanical and Mining Engineering, The University of Queensland, Queensland 4072, Australia
3.
Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, Liaoning, China

摘要

摘要: 以共价键或离子键结合的脆性单晶、多晶和光学玻璃是能源、通信、交通和医疗领域新兴微电子和光电器件的核心材料。为满足高性能器件的制造需求，脆性材料通常需要经过磨削、研磨、抛光等超精密磨粒加工，获得具有原子级光滑的表面、近无损伤的亚表面和微米甚至纳米级的加工精度。优化磨粒加工工艺不仅可以有效地提高加工效率，降低制造成本，还能够延长脆性材料元器件的服役寿命，但开发高效率、低损伤超精密磨粒加工技术需深入理解脆性材料纳米尺度的去除机理。本文基于划擦力学原理，揭示脆性材料纳米尺度磨粒加工去除的本质，阐明磨粒加工过程中脆性材料脆性–塑性转变去除的基本原理，概述单磨粒纳米划擦脆性材料的形变和去除机制，以及磨粒加工过程中脆性材料的去除机理及材料微观结构对其局部变形及后续去除的影响规律，提出实现脆性材料高效延性加工的控制策略，有助于推动脆性材料超精密磨粒加工技术的进一步发展。
- 脆性材料 /
- 磨粒加工 /
- 形变 /
- 破碎 /
- 去除机理
Abstract: Brittle solids with dominant covalent-ionic bonding, including single crystals, polycrystals, and optical glass, are core materials for modern microelectronic and optoelectronic devices that are widely used in energy, communication, transportation, and medicine sectors. In high performance device applications, those brittle materials must be machined into parts that often have an extremely smooth surface and a damage-free subsurface with sub-micron precision. Optimisation of an abrasive machining process for the brittle solids can significantly enhance production efficiency and reduce manufacturing cost, as well as prolong device life. The development of high efficiency and low damage ultraprecision shaping technologies for this class of solids requires an in-depth understanding of their deformation and removal mechanisms at nanoscale. In this work, the fundamental mechanisms of deformation and removal of brittle materials involved in individual or cumulative contacts with blunt and sharp grits are analysed, using the scratch-related micromechanics as the theoretical basis. Essentials of brittle-to-ductile transitions in abrasive machining are outlined. Influence of the diversity in material microstructures in determining local deformation and subsequent removal is highlighted. Practical requirements are suggested for further advancing ultraprecision abrasive machining of those brittle solids.
- brittle materials /
- abrasive machining /
- deformation /
- fracture /
- removal mechanism

HTML全文

图 1 脆性材料磨粒划擦诱导的形变和断裂模式

(a) 钝磨粒划擦诱导高脆性材料产生间断的锥形裂纹^[12]；(b) 锐磨粒划擦诱导高脆性材料产生中位裂纹、横向裂纹和径向裂纹，以及伴随横向裂纹及中位裂纹的塑性变形区^[13-14]；(c) 锐磨粒划擦较软的脆性材料产生具有微裂纹的近塑性变形^[15]；(d) 锐磨粒划擦脆性材料产生无裂纹的纯塑性变形^[1]

Figure 1. Deformation and fracture modes of brittle materials in translating blunt and sharp contacts

(a) Intermittent partial conical cracks on highly brittle surface induced by blunt abrasive scratching^[12]; (b) Median crack, lateral crack and radical crack in highly brittle body induced by sharp abrasive scratching^[13-14]; (c) Quasi-plastic deformation with micro cracks in relatively soft brittle material scratched by sharp abrasives^[15]; (d) Plastic deformation without cracks in brittle solid induced by sharp abrasive scratching^[1]

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图 2 脆性材料去除模式^[1-2]

(a) 钝磨粒多次重叠划擦导致破碎去除；(b) 锐磨粒划擦诱导材料横向断裂去除；(c) 锐磨粒划擦多晶材料诱导晶粒脱落去除；(d) 锐磨粒划擦产生挤压去除

Figure 2. Removal modes of brittle materials^[1-2]

(a) Fracture removal induced by overlapping scratches of blunt abrasive; (b) Lateral fracture generated by sharp abrasive scratching; (c) Grain ejecting produced by sharp abrasive scratching polycrystalline material; (d) Extrusion by sharp abrasive scratching

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图 3 脆性材料磨削加工示意图

高于延性域加工临界切深d_c的微裂纹深度为c，工件进给量为ν_w，砂轮旋转速度为ν_s

Figure 3. Surface grinding of brittle materials with ductile machining

Wheel rotational speed v_s, showing chip with micro-cracks of depth c above critical cutting depth d_c of workpiece infeed v_w

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图 4 单晶材料脆性域纳米划擦的亚表面TEM显微图

(a) 锐金刚石压头30 mN法向力划擦单晶Si；(b) 钝金刚石压头6 mN法向力划擦单晶GaAs^[3]；(c) 锐金刚石压头8 mN法向力划擦单晶GGG^[29]

Figure 4. TEM micrographs of nano-scratched subsurfaces of single crystal materials in brittle regime

(a) Single-crystal Si scratched with sharp diamond indenter at normal force of 30 mN; (b) Single-crystal GaAs^[3] scratched with blunt diamond indenter at normal force of 6 mN; (c) Single-crystal GGG^[29] scratched with sharp diamond indenter at normal force of 8 mN

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图 5 单晶材料延性域纳米划擦的亚表面TEM显微图

(a) 锐金刚石压头25 mN法向力划擦单晶Si导致{111}晶面发生滑移；(b) 钝金刚石压头1 mN法向力划擦单晶GaAs^[3]导致{111}晶面发生滑移；(c) 锐金刚石压头3 mN法向力划擦单晶GGG^[30]导致{114}晶面发生滑移

Figure 5. TEM micrographs of nano-scratched subsurfaces of single crystal materials in ductile regime

(a) Slip of {111} crystal planes when scratching single-crystal Si with sharp diamond indenter at normal force of 25 mN; (b) Slip of {111} crystal planes when scratching single-crystal GaAs^[3] with blunt diamond indenter at normal force of 1 mN; (c) Slip of {114} crystal planes when scratching single-crystal GGG^[30] with sharp diamond indenter at normal force of 3 mN

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图 6 尖锐金刚石压头划擦多晶AlN–2%Y₂O₃^[40]的表面SEM显微图

(a) 150 mN机械负载，压头半径90 nm；(b) 区域A的放大图；(c) 区域B的放大图

Figure 6. SEM of polycrystalline AlN–2%Y₂O₃^[40] nano-scratched by sharp diamond indenter

(a) Tip radius 90 nm, mechanical load of 150 mN; (b) Enlarged images of square A; (c) Enlarged image of square B

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图 7 单晶材料经金刚石砂轮脆性域磨削的亚表面TEM观测结果

(a) 磨粒粒径为20 μm，单晶GaAs^[46]；(b) 磨粒粒径为20 μm，单晶YAG^[9]；(c) 磨粒粒径约3 μm，单晶Ga₂O₃^[47]

Figure 7. Subsurface TEM micrographs of single crystals after brittle grinding with diamond grinding wheels

(a) Single-crystal GaAs^[46], grain size of 20 μm; (b) Single-crystal YAG^[9], grain size of 20 μm; (c) Single-crystal Ga₂O₃^[47], grain size of 3 μm

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图 8 单晶材料经金刚石砂轮延性域磨削的亚表面TEM显微图

(a) 磨粒粒径为9.0 μm，材料为Ga₂O₃^[48]；(b) 磨粒粒径为5.0 μm，单晶GaN；(c) 磨粒粒径为2.5 μm，单晶YAG^[9]； (d) 磨粒粒径为3.8 μm，单晶GGG^[10]

Figure 8. Subsurface TEM micrographs of single-crystal materials after ductile grinding with diamond grinding wheels

(a) Single-crystal Ga₂O₃^[48], grain size of 9.0 μm; (b) Single-crystal GaN, grain size of 5.0 μm; (c) Single-crystal YAG^[9], grain size of 2.5 μm; (d) Single-crystal GGG^[10], grain size of 3.8 μm

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图 9 单晶金刚石磨削多晶SiC陶瓷^[62]表面的SEM观测结果

(a) 脆性域(h_m=3 μm)；(b) 准延性域(h_m=0.02 μm)

Figure 9. Surface SEM micrographs of polycrystalline SiC ceramics^[62] ground by single crystal diamond

(a) Brittle (h_m=3 μm); (b) Quasi-ductility (h_m=0.02 μm)

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图 10 固结磨粒研磨硅酸盐玻璃^[71]表面的SEM显微图

(a) 脆性域(磨粒粒径为15.3 μm)；(b) 准延性域(磨粒粒径为2.5 μm)

Figure 10. SEM micrographs of BK7 optical glass^[71] surfaces lapped with fixed abrasive

(a) Brittle regime (grain size of 15.3 μm); (b) Quasi-ductile regime (grain size of 2.5 μm)

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